2019
DOI: 10.18698/0536-1044-2019-3-31-39
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An Analysis of Destructive Methods of Thin Films Thickness Measurement

Abstract: Thin film technologies are widely used in science and industry and have a critical value for optics and electronics. Special properties of thin films are related to their thickness, usually ranging between 1 nm and 1 um. Measuring such a thickness is a challenging task, always concomitant with the stage of technology development. When using witness samples and specimen control groups, destructive methods can be employed to measure the thickness of the deposited layers. An analysis of the most commonly used des… Show more

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Cited by 3 publications
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“…where D1 is the diffusion coefficient at T=1323 K, D1=2•10 -13 сm 2 /s [6]; t1duration of predeposition. The depth of the heterojunction was also determined experimentally by the oblique section method [7]. The experimental and calculated graphs of the dependence of xn+-p on the duration of predeposition are shown in Fig.…”
Section: Methodsmentioning
confidence: 99%
“…where D1 is the diffusion coefficient at T=1323 K, D1=2•10 -13 сm 2 /s [6]; t1duration of predeposition. The depth of the heterojunction was also determined experimentally by the oblique section method [7]. The experimental and calculated graphs of the dependence of xn+-p on the duration of predeposition are shown in Fig.…”
Section: Methodsmentioning
confidence: 99%