The thickness of thin films determines the films’ unique properties, due to which they are widely used in optics and electronics. To measure the thickness of films in the range of 1 nm — 1 mcm during film deposition or on a finished product, it is important that non-destructive measurement methods should be used. An analysis of the most commonly used non-destructive methods for measuring and controlling the thickness of thin films is performed, with a possibility of in situ control of the technological process as well as for testing of finished products. This work describes theoretical and practical considerations of using reflection high-energy electron diffraction, piezoelectricity, interferometry and gravimetric methods for thin film thickness measurements. The results of the study can be used for selecting an optimal method of obtaining thin films when conducting theoretical and applied research.

Thin film technologies are widely used in science and industry and have a critical value for optics and electronics. Special properties of thin films are related to their thickness, usually ranging between 1 nm and 1 um. Measuring such a thickness is a challenging task, always concomitant with the stage of technology development. When using witness samples and specimen control groups, destructive methods can be employed to measure the thickness of the deposited layers. An analysis of the most commonly used destructive methods of measuring the thickness of thin films is conducted, the results of which can be used for selecting a suitable method when planning corresponding experiments. This work describes theoretical and practical considerations of using bevel cut method, spherical cut method, atomic force microscopy and stylus profilometry for measuring thin film thickness.

One of the promising methods of thin film manufacturing is a method of pulse laser precipitation. By virtue of energetic peculiarities of laser impact upon a target this method is widely used at the formation of diamond-like structures. The manufacture of diamond-like structures on laser plant PLD-400 with the use of an excimer transmitter is described. Through the method of ellipsometry there is investigated a growth rate and peculiarities of thickness distribution under different conditions of precipitation.