Effect of wafer bow on electrostatic chucking and back side gas cooling Estimation of wafer warpage profile during thermal processing in microlithography Rev. Sci. Instrum. 76, 075111 (2005); 10.1063/1.1979468 Modeling of direct wafer bonding: Effect of wafer bow and etch patterns

Stable fixation of an orthopaedic implant to bone cement is critical to long term stability and durability in joint replacement. Poor interfacial bonding between metal and bone cement also leads to the formation of a nonadherent fibrous capsule in both soft and hard tissues, which can result in micromovement at the implant-tissue interface and ultimate failure of the implant. It is believed that some of the difficulties encountered by metallic implant devices can be reduced by the use of bioactive materials on the implant surface. In the current study MMA/HEMA coating, at a nominal thickness of 2mm, is present at the bone cement-metal interface. The MMA/HEMA coating is in the development stage. The goals of the present study are to assess the strength of the adhesive bond under loading and to assess its effectiveness with respect to increasing the osteoconductivity of the implant.