Channel temperature measurements of multi-finger AlGaN/GaN HEMTs by forward Schottky characteristics are presented. The temperature dependence of the forward gate-source Schottky junction voltage is investigated and it is used as the temperature sensitive parameter (TSP) by pulsed switching technique. The channel-to-mounting thermal resistance of the tested AlGaN/GaN HEMT sample is 19.6 ∘ C/W. Compared with both the measured results by micro-Raman method and simulated results of a three-dimensional heat conduction model, the physical meaning of the channel temperature for AlGaN/GaN HEMT tested by pulsed switching electrical TSP method is investigated quantitatively for the first time.

In this paper, the linear relationship of forward Schottky junction voltage of AlGaN/GaN HEMT with temperature was investigated. It was used as temperature sensitive parameter to determine the channel temperature at its normal working state by fast switch circuit technique. The regress of tested data was used to reduce the scatter error too. The thermal resistance constitution was extracted from the transient heating response curves. KeywordsHEMT, channel temperature, electrical method, reliabilityTemperature rise [℃] V  Forward Schottky voltage change T R Thermal resistance [℃/W] P Applied power [W]

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