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We report an 80 nm gate-length In0.17Al0.83N/GaN high-electron mobility transistor (HEMT) on silicon substrate with a record low gate leakage current of 7.12 × 10−7 A mm−1, a record high on/off current ratio of 1.58 × 106, and a steep subthreshold swing of 65 mV dec−1, which are excellent features among the reported InAlN/GaN HEMTs on Si. Due to the excellent DC performance, a current gain cutoff frequency fT of 200 GHz is achieved, resulting in fT × Lg = 16 GHz μm for GaN HEMTs on Si which to the best of our knowledge is a new record.

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The AlGaN/GaN heterostructure field-effect transistors with different gate lengths were fabricated. Based on the chosen of the Hamiltonian of the system and the additional polarization charges, two methods to calculate PCF scattering by the scattering theory were presented. By comparing the measured and calculated source-drain resistances, the effect of the different gate lengths on the PCF scattering potential was confirmed.