Spectral signatures of Cr(iii) complexes in deep eutectic mixtures were remarkably different from aqueous solutions due to exchange of the water ligands with ethylene glycol.
To get insight into the selective etching of
Al0.25Ga0.75normalAs
with respect to
normalGaAs
in acidic
I2+I−
containing solutions, etch rate measurements on the (100)‐face of both materials were performed as a function of several variables. By combining these results with those of electrochemical measurements (including rotating disk electrode (RDE) and rotating ring‐disk electrode (RRDE) techniques), it was established that at
Al0.25Ga0.75normalAs
an electroless etching mechanism operates, whereas at
normalGaAs
dissolution occurs by chemical etching. The observed selectivity in solutions with
I2
concentrations above 0.01 mol · liter−1 is essentially due to this difference in etching mechanism, which determines the concentration dependence of the etch rate as well as the influence of surface oxide layers on these rates.
All rights reserved. No part of contents of this paper may be reproduced or transmitted in any form or by any means without the written permission of Trans Tech Publications Ltd, www.scientific.net.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.