The interaction of low-energy XeF 2 with Si(100)(2 × 1) has been studied and compared to that of F 2 . Helium atom diffraction, beam-surface scattering, and thermal desorption measurements are the major techniques used in this study. It is found that XeF 2 dissociatively chemisorbs with high probability solely on the Si dangling bonds up to a coverage of about one monolayer (ML). Molecular fluorine has previously been observed to react similarly, saturating the dangling bonds at 1 ML coverage. The thermal desorption kinetics and products from the fluorinated layer produced by XeF 2 exposure are identical to those produced by F 2 exposure. The interactions of XeF 2 and F 2 are also strikingly similar with respect to the long-range order of the fluorinated Si up to about 1 ML coverage. The order is monitored by He diffraction. In both systems, the diffracted He beams exhibit a sharp decrease in intensity because of the disorder produced by the fluorination of random surface-unit cells as the coverage increases from 0 to about 0.3 ML. The intensity then increases until the fluorine overlayer has fully recovered its (2 × 1) periodicity at about 1 ML. This recovery corresponds to the decoration of each Si dangling bond with a fluorine atom. A critical observation of this study is that despite the large exothermicity of the dissociative chemisorption of XeF 2 or F 2 the order of the surface is not destroyed in either system. After saturation of the dangling bonds, F 2 ceases to react with the surface whereas XeF 2 continues to deposit fluorine by reacting with the Si-Si σ dimer bonds and the Si-Si lattice bonds. The order is destroyed as a result of the continued fluorine deposition, and ultimately, etching occurs by the formation of volatile SiF 4 . † Part of the special issue "John C. Tully Festschrift".

Xenon difluoride reacts with Si(100)2x1 by single atom abstraction whereby a dangling bond abstracts a F atom from XeF(2), scattering the complementary XeF product molecule into the gas phase, as observed in a molecular beam surface scattering experiment. Partitioning of the available reaction energy produces sufficient rovibrational excitation in XeF for dissociation of most of the XeF to occur. The resulting F and Xe atoms are shown to arise from the dissociation of gas phase XeF by demonstrating that the angle-resolved velocity distributions of F, Xe, and XeF conserve momentum, energy, and mass. Dissociation occurs within 2 A of the surface and within a vibrational period of the excited XeF molecule. Approximately an equal amount of the incident XeF(2) is observed to react by two atom abstraction, resulting in adsorption of a second F atom and scattering of a gas phase Xe atom. Two atom abstraction occurs for those XeF product molecules whose bond axes at the transition state are oriented within +/-60 degrees of the normal and with the F end pointed toward the surface.

Xenon difluoride interacts with Si(100)2 x 1 by atom abstraction, whereby a dangling bond abstracts a F atom from XeF2, scattering the complementary XeF. Partitioning of the reaction exothermicity produces sufficient XeF rovibrational excitation for dissociation to occur. The resulting F and Xe atoms are shown to arise from dissociation of XeF in the gas phase by demonstrating that the angle-resolved velocity distributions of F, Xe, and XeF conserve momentum, energy, and mass. This experiment documents the first observation of dissociation of a surface reaction product in the gas phase.

Xenon difluoride is observed to react with Si-Si sigma-dimer and sigma-lattice bonds of Si(100)2 x 1 at 150 K by single and two atom abstraction at F coverages above 1 ML. As in the limit of zero F coverage, a measurable fraction of the scattered, gas phase product of single atom abstraction, XeF, is sufficiently internally excited to dissociate into F and Xe atoms before detection. Using the XeF internal energy and orientation distributions determined in the limit of zero coverage, the laws of conservation of momentum, energy, and mass are applied to the measured F velocity and angular distributions at higher coverage to simulate the Xe atom velocity and angular distributions and their intensities at higher coverage. The simulation predicts the observed Xe atom velocity and angular distributions at high coverage reasonably well, largely because the exothermicity channeled to XeF remains approximately constant as the coverage increases. This constancy is an opportune consequence of the trade-off between the attractiveness of the potential energy surface as the coverage is increased and the dynamics of the XeF product along the potential surface. The energy, momentum, and mass conservation analysis is also used to distinguish between Xe atoms that arise from XeF gas phase dissociation and Xe atoms that are produced by two atom abstraction. This distinction enables the calculation of percentages of the single and two atom abstraction pathways, as well as the percentages of the two pathways available to the Xe atom produced by two atom abstraction, inelastic scattering, and desorption. Finally, the simulation reveals that between 9% and 12% of F atoms produced by gas phase dissociation of XeF are scattered back toward the surface. These F atoms likely react readily with Si to form the higher fluorides that ultimately lead to etching. Gas phase dissociation of the scattered product of a surface reaction is a novel mechanism to explain the unique reactivity of XeF(2) to etch Si in the absence of a plasma.