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Light-weight and flexible 2D MXene-based polymer materials with low dielectric loss and high dielectric constant have drawn great attention in the power systems and modern electronic field. A series of Ti 3 C 2 T x /EMA composites were fabricated via simple solution casting followed by a compression molding method with various mass concentrations of Ti 3 C 2 T x (0, 1, 3, 5, 8, 10, 12, and 15 wt%). Morphological and micro structural properties of the prepared composites were studied via X-ray diffraction (XRD) and fieldemission scanning electron microscope (FESEM), where the distribution of Ti 3 C 2 T x in the Ti 3 C 2 T x /EMA composites was confirmed. Thermal behaviors were analyzed by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) investigations. The DSC analysis reveals that the % of crystallinity decreases from 11.06 with 1 wt% to 5.68 with 15 wt%, where Ti 3 C 2 T x acts as an efficient nucleating agent. TGA data confirm the enhancement of the thermal stability of the composites upon increasing in Ti 3 C 2 T x loading. The room temperature electrical and dielectric behavior of the studied composites were examined in the frequency range of 100 Hz-5 MHz. In this work, the 10 wt% of Ti 3 C 2 T x loaded poly (ethylene-co-methyl acrylate) composite (EMA) showed higher dielectric permittivity (ε 0 = 124.22) with lower dissipation loss (tan δ = 0.051) at 100 Hz among all weight percentages. The behavior of charge carriers in the prepared composites was studied by utilizing the impedance spectroscopy technique. The electrical parameters were calculated from the fitted Nyquist plots with a corresponding circuit model. I-V curves confirmed the conduction mechanisms of the composites. This beneficial enhancement in electrical properties recommends the composite can be utilized in flexible electronic storage devices.

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