Abstract-Since the system-level package was proposed, the electronics industry has increasingly attached importance to both directly relevant and related issues, and the scope of system-level package usage has increased. Creating more complex systemlevel package structures, thereby leading to the design of overall electrical effects, requires more electromagnetic simulation resources, and therefore a great deal of time in the design process. The main purpose of this paper is to analyze the effects of system-level packaging, and to establish systems-in-package in accordance with electrical specifications. Using a segmented approach, this paper also builds an overall model for designers to predict electrical characteristics, thus shortening the product development schedule. In this paper, the transmission effects of a substrate are analyzed by changing the length of the substrate transmission line, with or without a thermal ground ball and ground ring. Previously established package IP are cascaded to establish the model of the package substrate, which verifies the feasibility of the package IP. We then analyze the characteristics of the interference between chips and package using an integrated passive device, and propose a complete package equivalent circuit model.

No abstract

No abstract

No abstract

Because the ICs' application frequency and speed become higher and trends of system packaging and device under test request higher reliability, a novel technology combining noncontacting measurement method and reconstructing radiation model was proposed to solve signal deliveries in system packages or PCBs. In this study, a novel noncontacting method for the ICs' measurements was investigated by the design of loop-type near-field probe and reconstructed the radiation model to substitute the traditional measurement methods, such as using probes and SMA connectors. A near-field probe was used to receive the coupling signal. The assessing circuit modeling could be completed by some synthesized theorems. According to the study's results, frequency responses of reconstruction model developed by theorems, radiation measurements, and simulated by EM methods were highly curve fitting.