This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.

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Commonplace electronic appliances for consumer or industrial use are still mostly rigid or at maximum flexible entities. The flexibility of foldable units like laptops or cell phones is usually realized through flexible circuit board (FCB) interconnectors. Although flexibility allows for considerably enhanced degrees of freedom in design, it is not compatible with more complex three dimensional curvatures and dynamics thereof. In the past years a number or approaches to realize stretchable electronic circuits in order to reach beyond unidirectional bending or folding of electronics have been reported. In the frame of the European Project STELLA a particular fabrication technology for stretchable electronic systems has been developed at Technische Universitaet Berlin. This technology, termed "stretchable circuit board" (SCB) technology, is derived from conventional printed circuit board manufacturing. Stretchability of the boards is enabled by (i) using polyurethane inst ead of FR4 or polyimide as a carrier material of the copper structures and (ii) a meandering design of the Cu interconnects between commercial (rigid) electronic components. Such boards can be (once) extended by up to 300 % before fracture of the Cu interconnections. For repeated elongation/relaxation cycles elongations with a few percent are allowable in order reach high cycle numbers. Electronic components are assembled after local application of a solder mask and surface finish for solderability. The electronic interconnection is established using a low temperature solder alloy (SnBi, Tm=142 °C). For protection and enhanced system robustness all components are subsequently encapsulated within a polyurethane capping. Systems thus realized can be readily attached to different kinds of surfaces. Most interesting for various application cases is the easy attachment to textile substrates by a simple lamination process. The field use case studies of stretchable systems in the frame of the STELLA are m

This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.

Assembly of electronic components on rigid and/or flexible printed circuit boards is today the customary way to fabricate electronic systems in stationary, mobile and automotive applications. On the other hand, many of the demands from emerging application fields like wearable and textile electronics cannot be met if with standard technologies. These fields have therefore become mayor drivers for the development of novel technologies. Among these 'stretchable electronics' have attracted much attention recently. Especially for textile applications the potential of the electronic system to comply with the body shape and movement will considerably improve the user comfort. In this paper we will present a cost effective technology for the realization of stretchable systems by common printed circuit board techniques like lamination, lithography, etching and micro via technology with polyurethane as a stretchable matrix/substrate material. Mastering of the adhesion between ma terials and the transitions region from stretchable to non-stretchable parts of the system are crucial for the mechanical performance and robustness. Technical approaches and the obtained results to tackle these issues will be presented. After a complete embedding of the components/interconnections the systems can be firmly attached to textile or non-woven cloth, which can be subsequently integrated into garments. The described process technology bears the potential for large scale roll to roll processing. Reliability aspects for stretchable electronic systems are so far not standardized and will be discussed briefly. Electrical and mechanical functionality of test vehicles subjected to multiple stretch and mild washing cycles will be presented. A functional electronic demonstrator with embedded passives, a micro controller, and LEDs which was realized with this technology will be shown