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A low-cost, non-destructive and flexible technique based on thermoreflectometry is presented in this paper to map the temperature of running devices integrated on a silicon chip. The analysed device is a micromachined gas sensor using silicon-on-insulator technology (SOI). The interests and limitations of the proposed optical technique are described and compared with commonly used methods in microelectronics. Moreover, experimental results of thermal mapping for micromachined gas sensors are also compared with numerical simulations. From the measured temperature distribution over the entire active area of micromachined gas sensors, optimized designs can be proposed for avoiding hot spots that degrade the performance of the integrated gas sensors.

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We present an imaging system that enables the extraction of three different types of information: First, the topography measurement of an electronic device at rest; then, two other informations are obtained when the same device is submitted to a transient current: on one hand, the induced surface displacement and on the other hand, the qualitative surface temperature variations field. The same bench includes two imaging techniques, one based upon interferometry, the other upon thermoreflectance, both of them using a light-emitting diode as a source of light. Results on a microheater are presented.

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