Scale-out datacenters mandate high per-server throughput to get the maximum benefit from the large TCO investment. Emerging applications (e.g., data serving and web search) that run in these datacenters operate on vast datasets that are not accommodated by on-die caches of existing server chips. Large caches reduce the die area available for cores and lower performance through long access latency when instructions are fetched. Performance on scale-out workloads is maximized through a modestly-sized last-level cache that captures the instruction footprint at the lowest possible access latency. In this work, we introduce a methodology for designing scalable and efficient scale-out server processors. Based on a metric of performance-density, we facilitate the design of optimal multi-core configurations, called pods. Each pod is a complete server that tightly couples a number of cores to a small last-level cache using a fast interconnect. Replicating the pod to fill the die area yields processors which have optimal performance density, leading to maximum per-chip throughput. Moreover, as each pod is a stand-alone server, scale-out processors avoid the expense of global (i.e., interpod) interconnect and coherence. These features synergistically maximize throughput, lower design complexity, and improve technology scalability. In 20nm technology, scaleout chips improve throughput by 5x-6.5x over conventional and by 1.6x-1.9x over emerging tiled organizations.

Abstract-1 We propose a power-efficient many-core server-onchip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense and fast Through-Silicon Vias (TSVs) instead of off-chip IOs, enabling faster data transfers at much lower energy per bit. We demonstrate a methodology that includes full-system microarchitectural modeling and rapid virtual physical prototyping with emphasis on the thermal analysis. Our findings show that while executing CPU-centric benchmarks (e.g. SPECInt and Dhrystone), the temperature in the server-on-chip (logic+DRAM) is in the range of 175-200• C at a power consumption of less than 20W, exceeding the reliable operating bounds without any cooling solutions, even with embedded cores. However, with real cloud workloads, the power density in the server-on-chip remains much below the temperatures reached by the CPU-centric workloads as a result of much lower power burnt by memory-intensive cloud workloads. We show that such a server-on-chip system is feasible with a lowcost passive heat sink eliminating the need for a high-cost active heat sink with an attached fan, creating an opportunity for overall cost and energy savings in datacenters.

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We present a test chip architecture which embeds a thorough set of process characterization ring oscillators into a synthesized digital circuit, such as a processor core. We discuss the motivation, implementation, and results from sub-40nm technology silicon.