The optimum condition of plasma-enhanced chemical vapor deposition to deposite silicon nitride (SiN x ) film and its application as a gate insulator of a-Si thin-film transistor (TFT) have been investigated. The internal stress of SiN x in the range of 4.3×109 dyn/cm2 tensile to 8.0×109 dyn/cm2 compressive is found to be controllable by changing the ratio of H2 and N2 in the source gases without affecting the optical band gap. Satisfactory TFT characteristics and high reliability are realized by using a gate insulator of SiN x having either stoichiometric or N-rich composition which shows the large optical band gap.

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An amorphous silicon TFT particularly suited for the full color liquid crystal display driver has been developed and reported here. Various fundamental factors involved in the a-Si TFT, such as the effects of structure, materials, and the method of fabrications were reviewed and investigated in terms of the field effect mobility, the threshold voltage and the reliabilities. An inverted-staggered TFT structure was employed for the purpose wherein the interface states between two layers was successfully lowered by employing the successive deposition procedures of SiNx gate insulator on the a-Si layer. Proper ohmic contacts and the blocking of hole injections were accomplished by forming a n+ layer between the a-Si layer and the source/drain metal electrodes which consists of a double layer of Al/MoSi2 in order to prevent the aluminum diffusion into the a-Si layer during the 300°C heat treatment at the succeeding fabrication processes. The degradation of display images due to the high intensity backlights was minimized by employing a light shielding layer and by making the thickness of a-Si layer 200 Å against the direct sunlight of up to 100,000 luxes. Stable actual performances of TFT for more than 4000 hours at 80 °C were confirmed. The development of a color LCD TV driven by this TFT is also reported.

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