Aluminum nitride (AlN) thin films were deposited on Si (100) substrates by using plasma-enhanced atomic layer deposition method (PEALD). Optimal PEALD parameters for AlN deposition were investigated. Under saturated deposition conditions, the clearly resolved fringes are observed from X-ray reflectivity (XRR) measurements, showing the perfectly smooth interface between the AlN film and Si (100). It is consistent with high-resolution image of the sharp interface analyzed by transmission electron microscope (TEM). The highly uniform thickness throughout the 2-inch size AlN film with blue covered surface was determined by spectroscopic ellipsometry (SE). Grazing incident X-ray diffraction (GIXRD) patterns indicate that the AlN films are polycrystalline with wurtzite structure and have a tendency to form (002) preferential orientation with increasing of the thickness. The obtained AlN films could open up a new approach of research in the use of AlN as the template to support gallium nitride (GaN) growth on silicon substrates.

Plasma-enhanced atomic-layer-deposited GaN thin-films have been introduced into planar perovskite solar cells as electron transport layers.

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A method for suppressing impurities in GaN thin films grown via plasma-enhanced atomic deposition (PEALD) through the in situ pretreatment of Si (100) substrate with plasma was developed. This approach leads to a superior GaN/Si (100) interface. After pretreatment, the thickness of the interfacial layer between GaN films and the substrates decreases from 2.0 to 1.6 nm, and the oxygen impurity content at the GaN/ Si (100) interface reduces from 34 to 12%. The pretreated GaN films exhibit thinner amorphous transition GaN layer of 5.3 nm in comparison with those nonpretreated of 18.0 nm, which indicates the improvement of crystallinity of GaN. High-quality GaN films with enhanced density are obtained because of the pretreatment. This promising approach is considered to facilitate the growth of high-quality thin films via PEALD.