As contact resistance becomes a bottle-neck in scaled CMOS devices, there is a need for source/drain epitaxy with maximum dopant concentrations and optimized contacting schemes. In this paper we discuss the use of highly doped Si:P layers for the Source/Drain formation in Si bulk FinFETs. We report on the macroscopic and microscopic properties of the Si:P layers and discuss the details of the microstructure and the manifestation of Phosphorus-Vacancy complexes at high Phosphorus concentrations. We analyze how a post-epi thermal budget like spike or laser annealing modifies the microstructure and leads to an enhanced P activation and diffusion. We also zoom in on some of the integration aspects of the Si:P layers and discuss the benefit of the high-P concentration for the contact resistivity and the final device performance.
In situ doped epitaxial Si:P films with P concentrations >1 × 1021 at./cm3 are suitable for source-drain stressors of n-FinFETs. These films combine the advantages of high conductivity derived from the high P doping with the creation of tensile strain in the Si channel. It has been suggested that the tensile strain developed in the Si:P films is due to the presence of local Si3P4 clusters, which however do not contribute to the electrical conductivity. During laser annealing, the Si3P4 clusters are expected to disperse resulting in an increased conductivity while the strain reduces slightly. However, the existence of Si3P4 is not proven. Based on first-principles simulations, we demonstrate that the formation of vacancy centered Si3P4 clusters, in the form of four P atoms bonded to a Si vacancy, is thermodynamically favorable at such high P concentrations. We suggest that during post epi-growth annealing, a fraction of the P atoms from these clusters are activated, while the remaining part goes into interstitial sites, thereby reducing strain. We corroborate our conjecture experimentally using positron annihilation spectroscopy, electron spin resonance, and Rutherford backscattering ion channeling studies.
Inline light scattering measurements are frequently used to determine wafer quality and cleanliness. In this paper we will show how this technique can be extended to determine the crystalline quality after hetero-epitaxy. Misfits on the surface of the epitaxial layer cause increased surface light scattering. The Si0.8Ge0.2-on-Si epitaxial quality has been evaluated by surface light scattering. A correlation is observed with the controlled variation of the interfacial oxygen between the Si substrate and epitaxial Si0.8Ge0.2.
Heavily P doped Si:P epitaxial layers have gained interest in recent times as a promising source-drain stressor material for n type FinFETs (Fin Field Effect Transistors). They are touted to provide excellent conductivity as well as tensile strain. Although the as-grown layers do provide tensile strain, their conductivity exhibits an unfavorable behavior. It reduces with increasing P concentration (P > 1E21 at/cm 3 ), accompanied by a saturation in the active carrier concentration. Subjecting the layers to laser annealing increases the conductivity and activates a fraction of P atoms. However, there is also a concurrent reduction in tensile strain (<1%). Literature proposes the formation of local semiconducting Si 3 P 4 complexes to explain the observed behaviors in Si:P [Z. Ye et al., ECS Trans., 50(9) 2013, p. 1007-1011. The development of tensile strain and the saturation in active carrier is attributed to the presence of local complexes while their dispersal on annealing is attributed to strain reduction and increase in active carrier density. However, the existence of such local complexes is not proven and a fundamental void exists in understanding the structure-property correlation in Si:P films. In this respect, our work investigates the reason behind the evolution of strain and electrical properties in the as-grown and annealed Si:P epitaxial layers using ab-initio techniques and corroborate the results with physical characterization techniques. It will be shown that the strain developed in Si:P films is not due to any specific complexes while the formation of Phosphorus-vacancy complexes will be shown responsible for the carrier saturation and the increase in resistivity in the as-grown films. Interstitial/precipitate formation is suggested to be a reason for the strain loss in the annealed films. The microelectronics industry is currently in the 14 nm node where 3 dimensional(3D) Si FinFET devices are already in production. Although new technologies and materials (e.g. Tunnel FETs, III-V channels, Ge channels etc.) have been proposed for the future transistor nodes, several technological and reliability challenges need to be overcome before those devices can be realized.1,2 Hence, the next couple of nodes (possibly up to 5 nm) may continue to be dominated by the Si FinFET technology. The performance of the Si FinFETs can be further scaled by the re-introduction of the source-drain S/D stressors that were first introduced in the 65 nm node for planar transistors. Typically, SiGe(B) S/D stressors that provide compressive stress are used for p type FinFETs 3 while Si:C(P) ones that provide tensile stress are for n-FinFETs. 4 Out of the two, the Si:C(P) stressors suffer from the problem of increasing resistivity with increasing C contents. 5,6 Subjecting the as-grown Si:C(P) layers to laser or spike annealing does not result in any significant improvement in the conductivity or carrier concentration. 5,6 Hence, instead of Si:C(P), heavily P doped Si:P films have gained prominent interest in recent times. ...
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
customersupport@researchsolutions.com
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.