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Mica powder which has never been reported as abrasives was found to be very effective for mechanochemical polishing of Silicon wafers. It has demonstrated to be excellent in terms of polishing rates and surface roughness, when a polisher was used much harder than the conventional hard polishers. The use of this type of new abrasives enables to improve the wafer flatness to meet the demand to reduce the edge exclusion for the next generation silicon wafers. Experimental ProcedureThe polishing experiment was carried out using a small polishing machine shown in Fig. 3, where

A monoclinic phase is frequently seen on fractured surfaces of yttria stabilized tetragonal ZrO2 polycrystals (Y-TZP). In this study, Y-TZP materials were ground by diamond grinding wheels of different grain sizes and the effects of grinding on the structure in the surface layers was examined from the viewpoint of the grinding mechanism. It was found that a compressive layer was formed on the ground surface and bending strength was increased by grinding under specific conditions.

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Newly developed engineering ceramics are very difficult to be ground using conventional diamond grinding wheel because of their poor dressability and low cutting ability. In this study, a rigid and porous vitrified diamond grinding wheel was made so that a diamond grain might not deteriorate and it might be tightly bonded to the bond bridge using proper frit bond at lower firing temperature. According to the grinding test results, the grinding force was very low and dimensional accuracy of ground ceramics was very excellent.