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Nitridation of hydrogen-terminated silicon with N2:N2O has been studied by x-ray photoemission spectroscopy. Our analysis has given evidence that the broad N(1s) peak at 398–399 eV, usually reported in the literature, is preceded by the formation of a narrow peak at 397.5 eV, attributed to the moiety Si3N in which silicon is only marginally oxidized, and two other peaks at 400.0 eV and 401.5 eV, attributed to the moieties Si2NOSi and SiNO, respectively.

This paper reports on the physical and temperature dependent electrical characterizations of the oxide/semiconductor interface in MOS capacitors with a SiO2 layer deposited on 4H-SiC using dichlorosilane and nitrogen-based vapor precursors. The capacitors, subjected to a standard post deposition annealing process in N2O, exhibited an interface state density Dit ≈ 9.0×10 11 cm -2 eV -1 below the conduction band edge. At room temperature, a barrier height (conduction band offset) of 2.8 eV was observed, along with the presence of negative charges in the insulator. The SiO2 insulating properties were evaluated by studying the experimental temperature dependence of the gate current. In particular, the temperature dependent electrical measurements showed a negative temperature coefficient of the Fowler-Nordheim electron barrier height (dΦB/dT = − 0.98 meV/°C), which was very close to the expected value for an ideal SiO2/4H-SiC system and much lower compared to the values reported for thermally grown SiO2. This smaller dependence of ΦB on the temperature represents a clear advantage of our deposited SiO2 for the operation of MOSFET devices at high temperatures.