We report the fabrication and experimental characterization of an ultra-high Q microdisk resonator in a silicon-on-insulator (SOI) platform. We examine the role of the substrate in the performance of such microdisk resonators. While substrate leakage loss has warranted the necessity of substrate undercut structures in the past, we show here that the substrate has a very useful role to play for both passive chip-scale device integration as well as active electronic device integration. Two device architectures for the disk-on-substrate are studied in order to assess the possibility of such an integration of high Q resonators and active components. Using an optimized process for fabrication of such a resonator device, we experimentally demonstrate a Q approximately 3 x 10(6), corresponding to a propagation loss approximately 0.16 dB/cm. This, to our knowledge, is the maximum Q observed for silicon microdisk cavities of this size for disk-on-substrate structures. Critical coupling for a resonance mode with an unloaded Q approximately 0.7 x 10(6) is observed. We also report a detailed comparison of the obtained experimental resonance spectrum with the theoretical and simulation analysis. The issue of waveguide-cavity coupling is investigated in detail and the conditions necessary for the existence or lack of critical coupling is elaborated.

High quality factor (Q approximately 3.4 x 10(6)) microdisk resonators are demonstrated in a Si(3)N(4) on SiO(2) platform at 652-660 nm with integrated in-plane coupling waveguides. Critical coupling to several radial modes is demonstrated using a rib-like structure with a thin Si(3)N(4) layer at the air-substrate interface to improve the coupling.

Recent developments in silicon based optoelectronics relevant to fiber optical communication are reviewed. Siliconon-insulator photonic integrated circuits represent a powerful platform that is truly compatible with standard CMOS processing. Progress in epitaxial growth of silicon alloys has created the potential for silicon based devices with tailored optical response in the near infrared. The deep submicrometer CMOS process can produce gigabits-per-second low-noise lightwave electronics. These trends combined with economical incentives will ensure that silicon-based optoelectronics will be a player in future fiber optical networks and systems.

High quality (Q approximately 6 x 10(5)) microdisk resonators are demonstrated in a Si(3)N(4) on SiO(2) platform at 652-660 nm with integrated in-plane wrap-around coupling waveguides to enable critical coupling to specific microdisk radial modes. Selective coupling to the first three radial modes with >20dB suppression of the other radial modes is achieved by controlling the wrap-around waveguide width. Advantages of such pulley-coupled microdisk resonators include single mode operation, ease of fabrication due to larger waveguide-resonator gaps, the possibility of resist reflow during the lithography phase to improve microdisk etched surface quality, and the ability to realize highly over-coupled microdisks suitable for low-loss delay lines and add-drop filters.

We experimentally demonstrate a high resolution integrated spectrometer on silicon on insulator (SOI) substrate using a large-scale array of microdonut resonators. Through top-view imaging and processing, the measured spectral response of the spectrometer shows a linewidth of ~0.6 nm with an operating bandwidth of ~50 nm. This high resolution and bandwidth is achieved in a compact size using miniaturized microdonut resonators (radius ~2 μm) with a high quality factor, single-mode operation, and a large free spectral range. The microspectrometer is realized using silicon process compatible fabrication and has a great potential as a high-resolution, large dynamic range, light-weight, compact, high-speed, and versatile microspectrometer.