an empirical self-heating SPICE MOSFET model which accurately portrays the vertical DMOS power MOSFET electrical and thermal responses is presented. This macro-model implementation is the culmination of years of evolution in MOSFET modeling. This new version brings together the thermal and the electrical models of a VDMOS MOSFET. The existing electrical model [2], [3] is highly accurate and is recognized in the industry. The sequence of the model calibration procedure using parametric data is described. Simulation response of the new self-heating MOSFET model track the dynamic thermal response and is independent of SPICE's global temperature definition.

Thermal loading of MOSFET (Metal-Oxide-Semiconductor-Field-Effect-Transistor) model is a very important factor for the reliability of power electronics systems. Thus, the junction temperature must be accurately estimated. This paper presents a new electro-thermal (ET) model for low voltage Power MOSFET rated at (30 V/13 A) by PSpice simulator to estimate junction temperature (Tj) and power loss. The (ET) model is composed of electrical network model and (RC) thermal network model. The parameters of the (RC) thermal network model are extracted from datasheet using genetic algorithms (GA) method for computation of the transient thermal impedance (Zth(j-c)). The propose model reflects superior performance in terms of flexibility and accuracy. The results obtained indicate a good matching between proposed model and manufacturer's data.

The4H-SiCvert ical double Imp lanted MOSFET (DIM OS) offers advantages over conventional silicon devices, enabling high system efficiency and/or reduced system size, weight and cost through its higher frequency operation. Co mpared to the best silicon IGBTs, the SiC device will improve system efficiency up to 2% and operate at 2-5 times the switching frequencies.In this paper we present an equivalent circuit Spice of 4H-SiC DIM OSFET fo r a wide temperature range. Simu lation for DC characteristics (I-V) of the SiC M OSFET with the exact device geometry is carried out using the commercial device simu lator Spice. All Sp ice parameters are extracted fro m the measurements, and a SPICE model for the DIMOS transistor has been developed and implemented in the circuit simu lator Orcad PSpice 10.5. The temperature dependent behaviour was simulated and analysed. A good agreement between the Spice simulat ion and analytical model evaluation for SiC DIMOS is demonstrated. Model parameters can be adjusted to obtain an optimu m device to be used in power system applications.

The estimation of the junction temperature (Tj) is very important factor for improving the reliability and efficiency of the power electronic converters. A new electro-thermal (ET) model of low voltage power MOSFET is described in this paper. The electro-thermal model allows fast estimation of the junction temperature, based on the transient thermal impedances (Zth) using the (RC) Foster thermal network model and total power losses. The parameters of the (RC) Foster thermal network model are extracted from the data provided by the manufacturer's datasheet using particle swarm optimization (PSO) method. Moreover, a dc/dc Buck converter is also analyzed by simulation to evaluate the electro-thermal model. The simulation results indicate a good agreement between the proposed model and manufacturer's data. Finally, the electro-thermal (ET) model simulation using this (RC) Foster thermal network model shows a reasonable accuracy for estimating the junction temperature in a Dc/Dc buck converter.