GaInN/GaN multi-quantum-shell (MQS) nanowires (NWs) are gaining increasing attention as promising materials for developing highly efficient long-wavelength micro-light emitting diodes (LEDs). To improve the emission properties in GaInN/GaN MQS NWs, it is necessary to suppress the emission from the (0001) c-plane MQS at the apex region, which featured with low crystalline quality. In this study, we investigated the enhancement of optical properties and the realization of micro-LEDs by confirming the effect of the (0001) plane region. A 7.9-fold enhancement of the electroluminescence (EL) intensity was demonstrated by removal the (0001) plane region via inductively coupled plasma (ICP) dry etching, owing to the promoted current injection into the (1–101) semi-polar and (10–10) non-polar sidewall area. To investigate the effect of the emission area on the samples with and without truncated (0001) plane region, devices with three different mesa areas (50 × 50, 100 × 100, and 100 × 200 μm2) were fabricated. An increased EL intensity with the reduced mesa areas was observed in the samples without dry etching of the (0001)-plane area, because more current can be injected into the sidewall region with higher crystalline quality and luminous efficiency than the (0001)-plane MQS. Under the same injection current density, the truncated samples’ light output was increased for more than ten times as compared to the samples without (0001)-plane etching. Therefore, it confirms the possibility of realizing highly efficient GaInN/GaN MQS NWs LEDs by eliminating the (0001) plane MQS region. A precise etching and surface passivation of the apex region is expected to further reduce the reverse leakage current and improve the performance in NW-LEDs.

Core−shell GaInN/GaN multiquantum shell (MQS) nanowires (NWs) are gaining great attention for high-efficiency microlight-emitting diodes (micro-LEDs) owing to the minimized etching region on their sidewall, nonpolar or semipolar emission planes, and ultralow density of dislocations. In this study, we evaluated the changes in NW morphologies and the corresponding device properties induced by GaInN/GaN superlattice (SL) structures. The cathodoluminescence intensities of the samples with 20 and 40 pairs of SLs were about 2.2 and 3.4 times higher, respectively, than that of the sample without SLs. The high-resolution scanning transmission electron microscopy (STEM) inspection confirmed that the high growth temperature of SLs prevented growth in the semipolar plane region close to the n-GaN core. A similar phenomenon was also observed for the GaN quantum barriers of the semipolar MQS region under a high growth temperature of 810 °C. This phenomenon was ascribed to the passivation of the semipolar plane surface by hydrogen atoms and the high probability of decomposition through NH 3 or N−H-related bonds. Although no clear SL grew on the semipolar plane near the n-core region, the top area of the nonpolar plane SL was expected to adequately suppress the point defects propagating from the n-GaN core to the semipolar plane MQS. The electroluminescence (EL) spectra and light output curves demonstrated a clear enhancement of more than 3-folds compared to the fabricated micro-LEDs without SL structures, which was associated with the improved crystalline quality of the MQS and enlarged area of the semipolar planes. Moreover, by increasing the growth time of GaN quantum barriers, the EL emission intensity of the micro-LED devices exhibited a 4-fold improvement owing to the reduced carrier overflow in the thickened GaN barriers on the semipolar (11̅ 01) planes. Thus, the results verified the possibility of realizing highly efficient NW-based micro-LEDs by optimizing the NW morphology using SL structures.

To light emitting diodes (LEDs), solving the common non-uniform current injection and efficiency degradation issues in (0001) plane micro-LED is essential. Herein, we investigated the light emission characteristics of various mesa sizes and different p-electrode areas toward the realization of coaxial GaInN/GaN multi-quantum-shell (MQS) nanowires (NWs)-based micro-LEDs. As the mesa area was reduced, the current leakage decreases, and further reduction of the area showed a possibility of realizing micro-LED with less current leakage. The large leakage path is mainly associated with the defective MQS structure on the (0001) plane area of each NW. Therefore, more NWs involved in an LED chip will induce higher reverse leakage. The current density-light output density characteristics showed considerably increased electroluminescence (EL) intensity as the mesa area decreased, owing to the promoted current injection into the efficient NW sidewalls under high current density. The samples with a mesa area of 50 × 50 µm2 showed 1.68 times higher light output density than an area of 100 × 100 µm2 under a current density of 1000 A/cm2. In particular, the emission from (1-101) and (10-10) planes did not exhibit an apparent peak shift caused by the quantum-confined Stark effect. Furthermore, by enlarging the p-electrode area, current can be uniformly injected into the entire chip with a trade-off of effective injection to the sidewall of each NW. High performance of the MQS NW-based micro-LED can be expected because of the mitigated efficiency degradation with a reducing mesa area and an optimal dimension of p-electrode.

Suppressing the emission from (0001) plane region with low luminescence efficiency that exists on the top of nanowires (NWs) is necessary to realize highly efficient GaInN/GaN multi quantum shell (MQS) light-emitting diodes (LEDs). In this study, we attempted to improve the crystal growth by introducing electron blocking layers (EBLs) and to suppress the current leak in NW LEDs by using SiO2 insulating film on top of NWs. The EBL structure features different thicknesses at each crystalline plane to reduce the current injection into (0001) plane, suppress red emission with low luminescence efficiency, and improve the light output by 2.4 times. Given that the luminescence from (0001) plane region remains, further optimization of EBL growth conditions, such as V/III ratio and Al composition, is essential. In addition, the luminescence from (0001) plane region and the current leakage can be reduced by forming SiO2 insulating film on top of the NWs. Although even if an insulating film was formed on the top of NWs on which EBLs were grown, the SiO2 adhering to (1-101) plane resulted in a decrease in light output and destruction due to high resistance. The results indicate the possibility of realizing highly efficient GaInN/GaN MQS-NW LEDs by inserting EBL structures between MQS and p-GaN shell.