In this work, copper nanowires (NWs) and Cu nanoparticles (NPs) were employed to increase the reliability of a printed electrode pattern under mechanical bending fatigue. The fabricated Cu NW/NP inks with different weight fractions of Cu NWs were printed on a polyimide substrate and flash light-sintered within a few milliseconds at room temperature under ambient conditions. Then, 1000 cycles of outer and inner bending fatigue tests were performed using a lab-made fatigue tester. The flash light-sintered Cu NW/NP ink film with 5 wt % Cu NWs prepared under the flash light-sintering conditions (12.5 J·cm–2 irradiation energy, 10 ms pulse duration, and one pulse) showed a lower resistivity (22.77 μΩ·cm) than those of the only Cu NPs and Cu NWs ink (94.01 μΩ·cm and 104.15 μΩ·cm, respectively). In addition, the resistance change (ΔR·R0(–1)) of the 5 wt % Cu NWs Cu NW/NP film was greatly enhanced to 4.19 compared to the 92.75 of the Cu NPs film obtained under mechanical fatigue conditions over 1000 cycles and an outer bending radius of 7 mm. These results were obtained by the densification and enhanced mechanical flexibility of flash light-sintered Cu NW/NP network, which resulted in prevention of crack initiation and propagation. To characterize the Cu NW/NP ink film, X-ray diffraction and scanning electron microscopy were used.
In this work, multiwalled carbon nanotubes (MWNTs) were employed to improve the conductivity and fatigue resistance of flash light sintered copper nanoparticle (NP) ink films. The effect of CNT weight fraction on the flash light sintering and the fatigue characteristics of Cu NP/CNT composite films were investigated. The effect of carbon nanotube length was also studied with regard to enhancing the conductivity and fatigue resistance of flash light sintered Cu NP/CNT composite films. The flash light irradiation energy was optimized to obtain high conductivity Cu NP/CNT composite films. Cu NP/CNT composite films fabricated via optimized flash light irradiation had the lowest resistivity (7.86 μΩ·cm), which was only 4.6 times higher than that of bulk Cu films (1.68 μΩ·cm). It was also demonstrated that Cu NP/CNT composite films had better durability and environmental stability than those of Cu NPs only.
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