No abstract

In this study, the properties of surface acoustic wave (SAW) filters, including phase velocity and electromechanical coupling coefficient (K2) are investigated. The effective surface permittivity (ESP) method was employed to estimate the K2 of bulk materials (single layer) and multi-layer (double-layer and trilayer) structures. In the cases of bulk materials, the calculation results agree with the experimental data, and the errors are less than 7% for quartz. In the cases of double-layer materials, the phase velocity and K2 of various materials, such as ZnO/Diamond and LiNbO3/Diamond, were acquired, and the results demonstrate that LiNbO3/diamond is the optimal choice for high-frequency SAW devices. For the cases of trilayer, the structure of ZnO/PZT/diamond has relatively high K2 and phase velocity. Therefore, this structure is the optimal trilayer structure for high-frequency SAW devices. The study demonstrates that ESP method can be successfully used for estimating SAW properties in piezoelectric multi-layer structures even though the structures contain nonpiezoelectric film (diamond). The proposed numerical computation has the potential to shorten the developing time of SAW device.

Prior to integrated circuit (IC) packaging, die performance must be verified using probe cards to screen for defective products. With the decrease in IC line width, the dimensions of the pads used for performance verification and the spacing between adjacent pads have also decreased. However, when the pad pitch is reduced to less than 30 μm, commonly used probe cards will face manufacturing problems in miniaturization. To resolve probe card manufacturing problems caused by the miniaturization of IC components, the use of an anisotropic conductive film (ACF) in probe cards was proposed in this study. Theoretical calculations and experimental testing of this probe structure were conducted to demonstrate the feasibility of this concept.In theoretical calculations, composite material and buckling theory were utilized to evaluate the buckling behavior of the ACF. In experimental testing, photolithography and electroplating techniques were used to control the line width and spacing intervals of the micron-scale metal wires in the ACF. After the ACF was fabricated, the mechanical properties of the ACF during wafer testing were assessed. Theoretical analyses and experimental testing verified that ACFs can potentially be applied to the performance verification of IC products. In the ACF structure, multiple probes came into contact with each pad. Therefore, ACFs can potentially be applied to the performance verification of IC components with pad diameters of less than 20 μm. The results of this study directly benefit the miniaturization of ICs.