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In this study, the physical and electrical characteristics of Al2O3/La2O3/Al2O3/Si stack structures affected by the thickness of an Al2O3 barrier layer between Si substrate and La2O3 layer are investigated after a rapid thermal annealing (RTA) treatment. Time of flight secondary ion mass spectrometry (TOF-SIMS) and X-ray photoelectron spectroscopy (XPS) tests indicate that an Al2O3 barrier layer (15 atomic layer deposition (ALD) cycles, approximately 1.5 nm) plays an important role in suppressing the diffusion of silicon atoms from Si substrate into the La2O3 layer during the annealing process. As a result, some properties of La2O3 dielectric degenerated by the diffusion of Si atoms are improved. Electrical measurements (C-V, J-V) show that the thickness of Al2O3 barrier layer can affect the shift of flat band voltage (VFB) and the magnitude of gate leakage current density.

The influence of processing parameters of aluminum oxide (Al2O3) and lanthanum oxide (La2O3) gate dielectric is investigated. Trimethylaluminum (TMA) and tris(isopropylcyclopentadienyl) lanthanum [La(iPrCp)3] were used as precursors separately, and H2O was used as oxidant. The ultra-thin La1 − xAlxO3 gate dielectric films are deposited on p-type silicon substrates by atom layer deposition (ALD) for different pulse ratios of precursors. Effects of different La/Al precursor pulse ratios on the physical properties and electrical characteristics of La1 − xAlxO3 films are studied. The preliminary testing results indicate that the increase of La precursor pulse can improve the characteristics of film, which has significant effects on the dielectric constant, equivalent oxide thickness (EOT), electrical properties, and stability of film.

We demonstrate an enhancement-mode (E-mode) Al2O3/InAlN/AlN/GaN metal–insulator–semiconductor high-electron-mobility transistor (MISHEMT) with enhanced breakdown voltage. The threshold voltage Vth shifts from −7.6 to 1.8 V using fluoride-based plasma treatment. The gate leakage current and the buffer leakage current were reduced by the conduction band modulation of negative fluorine charges. The reduction in the buffer leakage current enhanced the breakdown voltage from 80 to 183 V with LGD = 3 µm. The fabricated E-mode MISHEMT with a gate length of 1 µm exhibits a respectable drain current of 416 mA/mm and a peak transconductance of 150 mS/mm.