Cu-Zn (21%) alloy films were deposited onto glass substrates from two separate boats containing Cu and Zn respectively. The substrates were kept at different temperatures from 298 K to 545 K by a heater. Films of 1.4 μm thickness were studied by X-ray diffraction profile analysis and electrical resistivity measurement. After data processing the dislocation density and distribution, the probabilities of stacking faults and twin faults as well as the resistivity have been obtained. The results show that these parameters do not change monotonically with the substrate temperatures, but take minimum values between 410 K and 450 K. The behaviour can be understood by the film growth kinetics.

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