In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.Index Terms-optical interconnections, optical planar waveguides.

The experimental results show that the systematic heuristic approach for feature reduction can be successfully applied to achieve improved lesion discrimination. The feature reduction technique facilitates the elimination of redundant information that may inhibit lesion classification performance. The clinical application of this result is that automated skin lesion classification algorithm development can be fostered with systematic feature selection techniques.

We report here on the design, fabrication and high-speed performance of a novel parallel optical module with sixteen 10-Gb/s transmitter and receiver channels for a 160-Gb/s bidirectional aggregate data rate. The module utilizes a single-chip CMOS optical transceiver containing both transmitter and receiver circuits. 16-channel high-speed photodiode (PD) and VCSEL arrays are flip-chip attached to the low-power CMOS IC. The substrate emitting/illuminated VCSEL and PD arrays operate at 985 nm and include collimating lenses integrated into the backside of the substrate. The IC-OE assembly is then flip-chip attached to a high density organic package forming the transceiver optical module. The exclusive use of flip-chip packaging for both the IC-to-optoelectronic (OE) devices and for the IC-toorganic package minimizes the module footprint and associated packaging parasitics. The OE-on-IC assembly achieves a high area efficiency of 9.4 Gb/s/mm2 [1]. The complete organic carrier transceiver package provides a lowcost, low-profile module similar to a conventional chip-carrier that can be directly surface mounted to a circuit board using a conventional BGA solder process. SLC transceiver modules with transmitter and receiver OE-IC arrays were assembled and characterized. Operation of all 16 transmitters in the transceiver module was demonstrated at data rates >10 Gb/s. Similarly, all 16 receiver channels operated error-free at >10 Gb/s. The receiver eye-diagrams were generated using a second transceiver source and therefore constitute a full transceiver optical link.

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