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In this paper, a real time on-board orbit determination method using the extended kalman filter is suggested and its performance is analyzed in the environment of the orbit.

In this paper, development of wafer level fan-out (WLFO) technology using ajinomoto build-up film (ABF) substrate with laser ablation process is introduced for low cost and high electrical performance for millimeter wave application. Wafer level fan-out (WLFO) technology using ABF substrate can enhance routing density and provide smaller form factor with lower parasitic elements than flip-chip chip scale packages (FCCSP). Moreover, short electrical paths from die out to package out can be realized with WLFO, and the low-k ABF material provides good electrical properties for high frequency areas. In this paper, the process of WLFO using ABF substrate with laser drilling is explained and electrical parasitic elements are compared between FCCSP and WLFO using 3D simulation tools. In addition, electrical characterization of coplanar waveguide (CPW) structure and interconnection models from die I/O pad to balls using 3D EM simulation are conducted to estimate effectiveness on millimeter wave range. Actual measurements of CPW structures are also presented.

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In the development of emerging 3D IC packaging using TSV, wafer back side treatment is one of key processes. The TSV back side process called MEOL (Middle End Of Line) is a newly introduced process which is performed after front side treatment/bumping, or before chip stacking assembly. The MEOL process adapts some conventional fab processes such dry etch, PECVD, and CMP but there are some differences in the process conditions such as non-mask pattern etch, low temperature deposition of dielectric film, Cu and dielectric film polish and etc [1]. Moreover traditional processes of semi-conductor packaging such as edge trim, wafer back grinding and dicing are also adapted with some modified conditions. For thin wafer handling, wafer temporary bonding and debonding processes are introduced as well. TSV MEOL process consists of the above processes and other supporting ones. These various processes should be aligned or integrated to achieve high yield thru the best optimization. So, it is very important to understand relationship among the processes how they interact each other. This paper is to describe how to optimize every single process with its process monitoring activities in terms of TSV MEOL integration and also some challenges to overcome for volume production of TSV packaging.