This paper presented a simplified hardware architecture of the block cryptographic algorithm, HIGHT, for wireless applications like a RFID system. We have modified the original HIGHT algorithm that reduced the critical path in the key scheduler and dismissed redundant logics sharing encryption and decryption datapathes, and thereby yield a smaller silicon area. The proposed HIGHT supporting both encryption and decryption had 2,608 gates, 13% smaller than the original HIGHT design excluding decryption block. It consumes the average power 10.8 μW at 2.5 V for 100 kHz. It can be applicable to passive RFID tag without serious difficulty in size and power. Also, the maximum clock frequency of 125 MHz allows a data throughput rate of 235 Mbps that can support cryptography of high-speed multimedia data.

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This paper presents the implementation of a 3-D architecture for a biomedical-imaging system based on a multilayered system-on-system structure. The architecture consists of a complementary metal-oxide semiconductor image sensor layer, memory, 3-D discrete wavelet transform (3D-DWT), 3-D Advanced Encryption Standard (3D-AES), and an RF transmitter as an add-on layer. Multilayer silicon (Si) stacking permits fabrication and optimization of individual layers by different processing technology to achieve optimal performance. Utilization of through silicon via scheme can address required low-power operation as well as high-speed performance. Potential benefits of 3-D vertical integration include an improved form factor as well as a reduction in the total wiring length, multifunctionality, power efficiency, and flexible heterogeneous integration. The proposed imaging architecture was simulated by using Cadence Spectre and Synopsys HSPICE while implementation was carried out by Cadence Virtuoso and Mentor Graphic Calibre.

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