A new oxidation procedure of alkynes catalyzed by Tp(PPh(3))(CH(3)CN)Ru-Cl is presented, which provides an efficient way to obtain alkenyl 1,2-diketones via ruthenium alkenyl 1,2-diketone intermediates. In contrast, the analogous reactions with Tp(PPh(3))(PhCN)Ru-Cl gave rise to the ruthenium metallacycle complexes.

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To extend the application of ArF exposure tool, CPL is one of the most powerful technologies for the resolution enhancement. From previous study, the 2 nd level writing by E-Beam writer has been developed to ensure the manufacturability of CPL process [1]. To fulfill the application of CPL Mask, we implemented this technology for 65nm DRAM patterning. First we studied the performance and characteristics of CPL mask with optimized exposure illumination setting for the desired pattern and dimension of 65nm DRAM. Then the mask data for CPL mask manufacture has been generated by modeled pattern decomposition approach together with rule and modeled OPC. This was accomplished by using an engine named MaskWeaver TM . For the manufacture of CPL mask, we used a binary mask and the Qz was etched for the 180 degrees phase difference. We utilized a 2 nd level writing by an E-Beam writer to make the zebra pattern that was generated by the engine for the optimized patterning performance. The exposure tool we utilized for the verification of wafer patterning is an advanced 193nm exposure system. The process performance indexes such as MEEF, process window, CD uniformity were collected to show the capability of CPL process. Also, simulation and empirical data were compared to verify the performance of CPL technology. So by using an optimized CPL technology included mask data generation skill, mask making specifications, and ArF illumination optimization, we can meet the manufacture requirement of 65nm DRAM.

We successfully demonstrated the realization of fabricating protein sub-micro patterns for cell biology applications. To successfully generate the protein submicro patterns, some new designed procedures were involved into the DUV photolithography with micro contact printing process, such as TEOS film, RIE etching and AR3 coating. For the flexible aspect ratio requirements, TEOS film was added as a hard mask between photoresist and substrate for increasing the etching selectivity. According to our experimental results, the aspect ratio could be offered from 1.5 to 4.5 by RIE recipe tuning. When the pattern size is into sub-micro level, the sticking issue between silicon and PDMS will be getting worse. Besides, it also has very strong dependence with pattern sizes, pitches and shapes. We analyze the chemical mechanisms and select suitable material to be the buffer layer to avoid the crosslinking from these two materials. The AR3 layer was employed to be a buffer layer and successfully reduce the issue of pattern sticking. After that, we observed the neuron and cell outgrowth in these special designed protein sub-micro patterns. The investigated patterning process that combining with DUV photolithography and micro contact printing could be used to generate functional surfaces for cell biology applications