A nonpolymer material, calixarene derivative (hexaacetate p-methnylcalix[6]arene) was tested as a high-resolution negative resist under an electron beam lithography process. It showed under 10-mm resolution with little side roughness and high durability to halide plasma etching. A sub-10-nm Ge quantum wire was perfectly etched off without defects. Such a performance is suitable for nanoscale device processes.

Articles you may be interested inNonlinear large deflection of nanopillars fabricated by focused ion-beam induced chemical vapor deposition using double-cantilever testing Mechanical characteristics and applications of diamondlike-carbon cantilevers fabricated by focused-ion-beam chemical vapor deposition

The current state of focused ion beam (FIB) applications in relation to solid state devices is reviewed, and recent use of FIB technology for lithography, etching, deposition, and doping are described. Etching and deposition have become essential processes for failure analysis and for mask repair in silicon ULSL production. Furthermore, the FIB doping technique has been used to fabricate quantum effect devices.

Focused-ion-beam chemical vapor deposition (FIB-CVD) is an excellent technology for forming three-dimensional nanostructures. Various diamond-like-carbon (DLC) free-space-wirings have been demonstrated by FIB-CVD using a computer-controlled pattern generator, which is a commercially available pattern generator for electron-beam (EB) lithography. The material composition and crystal structure of DLC free-space-wiring were studied by transmission-electron microscopy and energy-dispersive x-ray spectroscopy. As a result, it became clear that DLC free-space-wiring is amorphous carbon containing a Ga core in the wire. Furthermore, the electrical resistivity measurement of DLC free-space-wiring was carried out by two terminal electrodes. Au electrodes were fabricated by EB lithography and a lift-off process. The electrical resistivity was about 100 Ω cm at room temperature.