The rapid development of micro/nano systems promotes the progress of micro energy storage devices. As one of the most significant representatives of micro energy storage devices, micro hydrogen fuel cells were initially studied by many laboratories and companies. However, hydrogen storage problems have restricted its further commercialization. The γ-graphdiyne (γ-GDY) has broad application prospects in the fields of energy storage and gas adsorption due to its unique structure with rigid nano-network and numerous uniform pores. However, the existence of various defects in γ-GDY caused varying degrees of influence on gas adsorption performance. In this study, Lithium (Li) was added into the intrinsic γ-GDY and vacancy defect γ-GDY (γ-VGDY) to obtain the Li-GDY and Li-VGDY, respectively. The first-principles calculation method was applied and the hydrogen storage performances of them were analysed. The results indicated that the best adsorption point of intrinsic γ-GDY is H2 point, which located at the centre of a large triangular hole of an acetylene chain. With large capacity hydrogen storage, doping Li atom could improve the hydrogen adsorption property of intrinsic γ-GDY; meanwhile, vacancy defect inspires the hydrogen storage performance further of Li-VGDY. The mass hydrogen storage density for Li2H56-GDY and Li2H56-VGDY model were 13.02% and 14.66%, respectively. Moreover, the Li2H56-GDY and Li2H56-VGDY model had same volumetric storage density, with values that could achieve 5.22 × 104 kg/m3.

The electronic devices suffer great vibration and temperature fluctuation in an airborne environment, which has been always a big challenge for reliability design. In this paper, the reliability of the complex electronic components for airborne applications under a thermal cycling test, random vibration and combined loading has been investigated by experiment tests and finite element simulation. The fatigue life and failure location under different loadings have been compared and discussed, respectively. The results indicated that the combined fatigue life was much shorter than a single-factor experiment. The failed solder joints mostly appeared at the interface between the solder and the copper pad on the component side and the location was at the corner for all three harsh environment tests. Nevertheless, several differences could be observed. For temperature cycling, all the specimens failed due to the increase in daisy chain resistance rather than the open circuit for the combined loading test. That is because the degeneration of the solder caused by temperature variation led to lower stress levels and fatigue life. Moreover, the pins fractured at the welding regions have been observed. The modified Coffin—Manson model, Miner’s linear fatigue damage criterion and Steinberg’s model and rapid life-prediction approach were used to predict the fatigue life under temperature cycling, random vibration and combined loading, respectively. With these methods, the accurate numerical models could be developed and validated by experiment results. Thanks to the simulation, the design time could be effectively shortened and the weak point could be determined.

With the increasing number of inputs and outputs, and the decreasing interconnection spacing, electrical interconnection failures caused by electromigration (EM) have attracted more and more attention. The electromigration reliability and failure mechanism of complex components were studied in this paper. The failure mechanism and reliability of complex components during the electromigration process were studied through the simulation and the experiment, which can overcome the limitation of experimental measurement at a micro-scale. The simulation results indicated that the solder joint has obvious current crowding at the current inlet, which will significantly enhance the electromigration effect. Based on the atomic flux divergence method, the void formation of solder joints can be effectively predicted, and life prediction can be more accurate than Black’s equation. Experimental results indicated that the resistance of the daisy chain could be significantly increased with the process of void formation in the solder and corrosion of the leads. Moreover, the growth of intermetallic compounds can be obviously promoted under current stress. The main composition of the intermetallic compounds changes from almost entirely Cu5Sn6 to Cu5Sn6 and Cu3Sn; the cracks can be detected at the Cu3Sn layer. Specifically, the mean time to failure is 1065 h under 1.4 A current and 125 °C based on IPC-9701A guidelines.

The development of integrated circuits and packaging technology has led to smaller and smaller transmission line sizes and higher and higher operating frequencies up to nearly 100 GHz. However, the skinning depth of transmission lines due to eddy currents becomes smaller and smaller as the operating frequency of coplanar wave guide (CPW) transmission lines becomes higher and higher, while the reduction of device size makes the skinning depth consistent with the surface roughness of the device. In this paper, the concept of modified roughness coefficient was proposed based on the existing correlation factor. The concept of threshold modified roughness coefficient was proposed with a 20 dB reflection coefficient as the threshold value. The effect of surface roughness on transmission line transmission performance at frequencies above 100 GHz up to 1000 GHz was investigated. It was found that when the operating frequency of the signal was greater than the threshold roughness coefficient, the effect of surface roughness on the transmission line reflection coefficient should be considered. The modified roughness coefficient in this paper could quickly determine the effect of surface roughness on transmission line performance at different frequencies.

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