2004 IEEE International Solid-State Circuits Conference (IEEE Cat. No.04CH37519)
DOI: 10.1109/isscc.2004.1332785
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64 GHz and 100 GHz VCOs in 90 nm CMOS using optimum pumping method

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Cited by 76 publications
(19 citation statements)
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“…The advantages of complementary metal-oxide semiconductor (CMOS) technology for RF and microwave control functions over GaAs are its low-cost structure and its integration potential of RF, intermediate frequency (IF), and baseband blocks on the same die. Owing to the continuous scaling down of the CMOS technology, RF/microwave building blocks have moved from low gigahertz to higher frequency applications [1], [2].…”
Section: Introductionmentioning
confidence: 99%
“…The advantages of complementary metal-oxide semiconductor (CMOS) technology for RF and microwave control functions over GaAs are its low-cost structure and its integration potential of RF, intermediate frequency (IF), and baseband blocks on the same die. Owing to the continuous scaling down of the CMOS technology, RF/microwave building blocks have moved from low gigahertz to higher frequency applications [1], [2].…”
Section: Introductionmentioning
confidence: 99%
“…A pair of coupled thin-film microstrip lines are used as the resonator which has a odd-mode characteristic impedance of 65. 5 and odd-mode attenuation of 560 dB/m. Breaking point A in Fig.…”
Section: Mmic Process and The 90-ghz Vcomentioning
confidence: 99%
“…Due to low device gain and high transmission line loss, the fundamental VCO is not easy to realize at millimeter-wave frequency. A four-stages amplifier to increase the open loop gain [5] and a special layout for cross-coupled pair to improve the loss of the interconnections and the circuit symmetry [6] have been reported.…”
Section: Introductionmentioning
confidence: 99%
“…The 16 phase oscillator, by far the largest analog component in the core, should fit in 1 mm 2 , by analogy to a similar oscillatorHashemi et al [2004]. These chips could be built in a standard CMOS process [Doan et al, 2004;Franca-Neto et al, 2004], which costs about $1000 per 200 mm wafer processed [Clendenin, 2004]. About 1800 chips of this size would fit on a 200 mm wafer, and since the chips are small, the yield should be good (Bluetooth transceiver chips, a similar part, expect yields of 80-90% [Koupal et al, 2003]).…”
Section: The Chipmentioning
confidence: 99%