A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance

Abstract

A power module for hybrid electric vehicles is designed and constructed applying innovative packaging technologies. Instead of a DCB (direct copper bond) substrate and bond wire connections PCB (printed circuit board) technologies with embedded power semiconductors are used to build a 50kW automotive drive train inverter (Power PCB). The PCB technologies enable the design of very flat, compact and low-inductive power modules. The thermal performance of these modules is comparable to conventional DCB solutions. The built Power PCB is proven to be far superior compared to an equivalent bond wire solution in terms of switching performance. In fact, the parasitic dc-link inductance can be drastically reduced from 15:4nH (standard) down to 2:8nH (Power PCB). Thereby, the turn-off overvoltages are decreased significantly. Consequently, the switching losses are reduced and also conduction losses can be potentially reduced by an optional increase of the dc-link voltage. Thereby, the energy efficiency of electric vehicles can be substantially enhanced

Dielectric strength and thermal performance of PCB-embedded power electronics

“…In addition, the low parasitic inductance provided by the embedded technology offers the potential to better utilize the maximum chip voltages and the use of fast switching semiconductors. Compared to a standard module of 15.4 nH, the measurement at the embedded module showed 2.8 nH (Neeb et al, 2014) …”

“…In addition, the low parasitic inductance of 2.8 nH provided by the embedded technology offers the potential to better utilize the maximum chip voltages and the use of fast switching semiconductors [2]. By combination with silver sintering for the die attach, higher lifetimes compared with standard DCB assemblies may be reached in a lifetime model [3].…”

“…In addition, the low parasitic inductance provided by the embedded technology offers the potential to better utilize the maximum chip voltages and the use of fast switching semiconductors. Compared to a standard module of 15.4 nH, the measurement at the embedded module showed 2.8 nH (Neeb et al, 2014) Heat-spreading in the thick copper plate inside the printed circuit board improves the thermal conductivity. At the same time, by combination with silver sintering for the die attach, higher lifetimes compared with standard DCB (direct copper bonding) assemblies may be reached.…”

Characteristics and aging of PCB embedded power electronics

“…These improvements are smaller size, lightweight construction, cost efficiency of the applied materials and low parasitic inductances [3,7]. First products for application below 60 V are already in production [11].…”

A Fast-Switching Integrated Full-Bridge Power Module Based on GaN eHEMT Devices

“…This eliminates the use of bond wires. The concept reduces the parasitic inductance in the power loop, reported at 2.8 nH [12]. But, it is hard to achieve both good thermal and electrostatic performance simultaneously [15].…”