A 77-GHz SiGe single-chip four-channel transceiver module with integrated antennas in embedded wafer-level BGA package

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

Pressel

Beer

2015

Self Cite

In this paper, we present the novel embedded Z line (EZL) interconnection technology, which allows fabricating vertical contacts in the embedded wafer level ball grid array (eWLB) package. The presented solution enables the realization of vertical interconnections and passive components of wide range of widths and pitches and high metal-pattern resolution. We discuss the electrical characteristics of interconnections and high-frequency transitions realized using EZLs and compare them to structures realized using through encapsulant vias (TEVs) and through silicon vias (TSVs). We show examples of high-density EZL daisy chain structure and 3D package for RF-powered sensor with EZL interconnections to demonstrate the feasibility of the EZL technology. We present the concept of vertical antenna integration using EZL and show measurement results of a vertical EZL dipole antenna integrated in an eWLB package to demonstrate the flexibility and millimeter-wave capabilities of the EZL technology. The presented examples demonstrate that the new EZL technology is competitive to both TEV and TSV interconnect options and that it is particularly interesting for systems combining RF/high-speed and power devices.

Section: Vertical Dipole Antenna Using Ezlmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Novel embedded Z line (EZL) vertical interconnect technology for eWLB

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

Pressel

Beer

2015

Self Cite

“…5 shows the resistivityfrequency plot which defines the propagation mode depending on resistivity of Si. The solid blue curve denotes the dielectric relaxation frequency f sub : sub sub 0 r sub (6) At frequencies below f sub the resistive losses of Si dominate over capacitive component leading to increased effective capacitance seen by a travelling signal ( ox ). At frequencies above f sub the electric filed can penetrate the Si substrate which decreases the effective capacitance ( ) of Si.…”

Section: (B)mentioning

confidence: 99%

“…The eWLB has demonstrated to be an excellent platform for system integration with excellent high-frequency performance. On the one hand side-by-side multi-chip integration in an eWLB package, possibly with high-quality (high-Q) embedded passives in the fan out region of the redistribution layer (RDL), is an attractive SiP solution [3,4,5,6]. On the other hand the use of vertical interconnections in the package and double-sided RDL extend the integration capabilities to the third dimension (3D).…”

mentioning

confidence: 99%

Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

Pressel

Beer

et al. 2014

Self Cite

In this paper we investigate two vertical interconnect options for high-frequency system-in-package (SiP) integration: through encapsulant via (TEV) applied to the embedded wafer level ball grid array (eWLB) technology and through silicon via (TSV). We compare both solutions in terms of size and electrical performance. We use analytic expressions and electromagnetic simulations for our analysis and present measurement results of selected structures for verification. The results show that the choice of TEV and TSV depends on application and cost window

“…In the standard antenna concept in eWLB with single-layer RDL, the top layer of PCB is used as a reflector. [1,2,3,4,5] A. Package size Size of the package is an important parameter to design an antenna in package.…”

Section: Antenna Package Interaction In Ewlbmentioning

confidence: 99%

The impact of embedded wafer level BGA package on the antenna performance

PourMousavi

2013 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC)

Agethen

et al. 2013

Self Cite

In this article, we present a study about the impact of embedded wafer level ball grid array (eWLB) on characteristics of antenna. The antenna in package is a promising solution for integration of antennas and eWLB technology enables integration of passive components and antennas into the redistribution layer (RDL). The antenna radiates perpendicular to the package in broadside into the package. There are different parameters such as size, shape, and thickness of the eWLB package which affect the radiation pattern significantly. Moreover, the materials properties of r impact the impedance bandwidth, gain and efficiency of antenna and have to be taken into account. The other important parameter to design the antenna in package is the distance of antenna to the reflector. We present the feasibility of an antenna with backside metallization as an integrated reflector in an 8 mm x 8 mm eWLB package. The measurement and simulation results show that eWLB is an attractive candidate for mm-wave applications.Index Terms -eWLB package, system-in-package, integrated antenna, antenna in package, millimeter wave radar.