2001
DOI: 10.1081/amp-100108527
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A Comparative Study of the Preparation and Characterization of Aromatic and Aliphatic Bismaleimides to Produce Modified Siliconized Epoxy Intercrosslinked Matrices for Engineering Applications

Abstract: A novel hybrid intercrosslinked network of hydroxyl-terminated polydimethylsiloxane modified epoxy and bismaleimides [N,N′-bismaleimido-4,4′-diphenylmethane and 1,6-bis(maleimido)hexane] matrix systems were developed. Epoxy resin was modified with 5, 10, and 15% (wt%) of hydroxyl-terminated polydimethylsiloxane using γ-aminopropyltriethoxysilane as crosslinking agent and dibutyltindilaurate as catalyst. The reaction between hydroxyl-terminated polydimethylsiloxane and epoxy resin was confirmed by IR spectral s… Show more

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Cited by 13 publications
(4 citation statements)
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“…It was noted that the siloxane moiety incorporated epoxy matrix enhances the impacts owing to stress-strain properties of a minor change in glass transition behavior 18,19 . Progressiveness in thermo-mechanical behaviors was attained due to the inclusion of BMI core into epoxy matrix [20][21][22][23][24] , siliconized epoxy 25 and unsaturated polyester resin 26 . BMIs are considered as a class of better temperature withstanding thermoset like polyimides and they find a wide range of applications in aerospace and electronics industries 27 .…”
Section: Introductionmentioning
confidence: 99%
“…It was noted that the siloxane moiety incorporated epoxy matrix enhances the impacts owing to stress-strain properties of a minor change in glass transition behavior 18,19 . Progressiveness in thermo-mechanical behaviors was attained due to the inclusion of BMI core into epoxy matrix [20][21][22][23][24] , siliconized epoxy 25 and unsaturated polyester resin 26 . BMIs are considered as a class of better temperature withstanding thermoset like polyimides and they find a wide range of applications in aerospace and electronics industries 27 .…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy resin is a relatively new polymer material for electronic packaging with features of great stability, rigidity, and flexibility . However, modern electronic instruments develop quite fast in lots of areas today and the requirements of the functions are becoming much more meticulous and characteristic.…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy resin is one of the most important thermosetting polymeric materials, which have been widely used as high‐performance adhesives, coatings, matrices for composites, and electronic encapsulating materials because of their outstanding adhesion to various surfaces, light weight, high strength, good durability, and high stability under ultraviolet exposure, excellent chemical resistance, and easy processing. They are used in aerospace, automobiles, land and marine transportation, chemical process industries, and electrical and electronic industries . However, the brittle behavior of epoxy resin restricts its utility for a number of high‐performance applications.…”
Section: Introductionmentioning
confidence: 99%
“…. Earlier, we have studied the development of epoxy‐based composites and nanocomposites and results show better improvement in thermal, thermomechanical, mechanical, and dielectric properties . However, in order to improve thermomechanical properties furthermore to utilize for high‐performance applications, it is proposed to use glycidyl‐terminated hyperbranched polysiloxane (HPSiE) as a modifier for DGEBA to obtain high‐performance DGEBA resin.…”
Section: Introductionmentioning
confidence: 99%