A Direct Write Laser Pattern Generator For Rapid Semiconductor Device Customization

Abstract

A turn -key system for rapidly producing application specific integrated circuit devices (ASICs) has been developed. A design program is translated from the compiler work station directly to the interconnection metallization of a pre -processed but unpersonalized wafer by a direct write laser pattern generator (DWLPG). This instrument efficiently and precisely exposes photoresist and allows interconnection metal not pertinent to the circuit operation to be removed by etching.

Laser Beam Lithography for Direct Patterning of Interconnections on Prediffused ASIC's

“…The CAD patterns have to be physically reproduced on the substrate taking into account the preceeding layers in order to perform a correct alignment. The techniques based on a common stamp for the CAD design and the substrate, need stamped substrates, that is to say an additional step for standard substrates [5].…”