1998
DOI: 10.1109/55.663526
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A dual-metal-trench Schottky pinch-rectifier in 4H-SiC

Abstract: Characteristics of high-voltage dual-metal-trench (DMT) SiC Schottky pinch-rectifiers are reported for the first time. At a reverse bias of 300 V, the reverse leakage current of the SiC DMT device is 75 times less than that of a planar device while the forward bias characteristics remain comparable to those of a planar device. In this work, 4H-SiC pinch-rectifiers have been fabricated using a small/large barrier height (Ti/Ni) DMT device structure. The DMT structure is specially designed to permit simple fabri… Show more

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Cited by 55 publications
(25 citation statements)
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“…In order to reduce the reverse leakage current of SiC SBDs, various methods have been proposed through the years [116,[124][125][126][127][128][129][130][131][132][133][134][135][136][137][138][139][140][141]. These include the Junction Barrier Schottky In Table 6, various structures reported to reduce the reverse leakage current and increase on-off current ratio of the SBD are listed through recently years.…”
Section: Hybrid Structures For Leakage Current Reductionmentioning
confidence: 99%
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“…In order to reduce the reverse leakage current of SiC SBDs, various methods have been proposed through the years [116,[124][125][126][127][128][129][130][131][132][133][134][135][136][137][138][139][140][141]. These include the Junction Barrier Schottky In Table 6, various structures reported to reduce the reverse leakage current and increase on-off current ratio of the SBD are listed through recently years.…”
Section: Hybrid Structures For Leakage Current Reductionmentioning
confidence: 99%
“…(The only exception is if the MPS diode has its P + -n junction forward biased, injecting minority carriers and modulating the drift layer conductivity.) The amount of increase in forward voltage drop is a function of relative area of the P + regions to the total active device area [116,124]. The smaller the relative area of the P + regions, the less penalty on the forward voltage drop will incur.…”
Section: F = V Sb + I F (R Grid + R Dr + R Sub + R Conma ) (19)mentioning
confidence: 99%
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“…In the past, several vertical Schottky rectifier structures on SiC have been reported [2]- [5] with improved reverse characteristics due to the suppression of the barrier lowering effect which is the primary cause of the increased reverse leakage current in the SiC Schottky rectifiers. However, lateral Schottky rectifiers are increasingly becoming important because of their application in power ICs.…”
Section: Introductionmentioning
confidence: 99%
“…However, the major inherent disadvantage of Schottky rectifiers is the high reverse leakage current density, when compared to the PiN junction rectifiers. In order to achieve a low leakage current density while maintaining good forward characteristics, hybrid rectifiers, such as the junction barrier Schottky (JBS) and dual metal trench (DMT) Schottky rectifiers, have been explored in SiC [4], [5]. Although these devices operate with different principles in the forward region, the design concepts used to reduce reverse leakage current are similar.…”
mentioning
confidence: 99%