“…To achieve an optimal RF performance with the least parasitic capacitance, RF transistors with the minimal gate length of 40 nm are used for the transistors or M2 (M1) and M 2 . On account of the design trade‐off between noise figure and power consumption, the
ratio of M 1 and M 2 was optimised so that the transistors provide a g m of 15.7 mS when the gate bias voltage is fixed to 0.5 V. To suppress the leakage current, thick‐oxide‐gate transistors M 3 − M 5 , instead of normal transistors applied in [
44], were used as power switches. In particular, the newly added pMOS M 5 effectively cuts off the drain‐to‐gate leakage current flowing from V DD,AFE into the gate of nMOS M 2 , and also suppresses the drain‐to‐source leakage current flowing from V DD,AFE into the source of M 1 .…”