“…Moreover, the higher switching frequencies allowed by wideband power devices, such as gallium nitride high-electron-mobility transistors (GaN HEMT) and silicon carbide (SiC) MOSFETs, will require a CMTI beyond 200 kV/µs [2,3]. Traditional chip-scale isolators are based on capacitors [4,5], transformers [6][7][8][9][10][11][12][13][14], and LC hybrid networks [15], which exploit either thick silicon dioxide or polyimide layers as an isolation barrier. These approaches reveal inherent limitations in terms of both isolation rating and CMTI due to the maximum manufacturable dielectric thickness and related capacitive parasitics, respectively.…”