2000
DOI: 10.1109/55.887483
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A novel trench clustered insulated gate bipolar transistor (TCIGBT)

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Cited by 22 publications
(8 citation statements)
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“…The reduction in short circuit capability in scaled TIGBT is attributed to the Collector Induced Barrier Lowering (CIBL) effect [8], which is caused by conductivity modulation in the MOS channels [9]. Unlike the IE effect in TIGBTs, The Trench Clustered IGBT (TCIGBT) utilizes controlled thyristor action (pnpn effect) to reduce on-state losses [10]. Moreover, TCIGBT exhibits a unique self-clamping feature to protect the cathode cells and achieve low saturation currents without sacrificing on-state forward voltage drop.…”
Section: Recommended For Publication By Associate Editormentioning
confidence: 99%
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“…The reduction in short circuit capability in scaled TIGBT is attributed to the Collector Induced Barrier Lowering (CIBL) effect [8], which is caused by conductivity modulation in the MOS channels [9]. Unlike the IE effect in TIGBTs, The Trench Clustered IGBT (TCIGBT) utilizes controlled thyristor action (pnpn effect) to reduce on-state losses [10]. Moreover, TCIGBT exhibits a unique self-clamping feature to protect the cathode cells and achieve low saturation currents without sacrificing on-state forward voltage drop.…”
Section: Recommended For Publication By Associate Editormentioning
confidence: 99%
“…The conductivity modulation is significantly enhanced because of thyristor action. Hence, the on-state loss is effectively reduced compared to the IGBT structure [10][11][12]. After the TCIGBT structure turns on, current is continuously controlled by the MOS gate.…”
Section: Recommended For Publication By Associate Editormentioning
confidence: 99%
“…The 2D nature of this electron current flow causes a potential drop across the R n ‐buffer which is parallel to the p‐anode region. When the potential drop is sufficient to forward bias the p‐anode/n‐buffer junction, the PNP transistor turns on and the device operates in the same way as a conventional TCIGBT [7]. The injected charge modulates the conductivity of the n‐drift region, decreasing its resistance and causing snap back in the current–voltage characteristic.…”
Section: Introductionmentioning
confidence: 99%
“…Although V on decreases as the dose of the N-layer (D NL ) increases, D NL could not be too high due to it strongly affects the breakdown voltage (BV) [2][3][4][5]. In addition, in order to improve the short-circuit safe operating area, the saturation current of TIGBT needs to be decreased, which could be achieved by clamping the drain-to-source voltage (V DS ) of the trench nMOS [3,4,6]. However, clamping V DS by depleting the N-layer or by a selfbiased pMOS would limit the value of D NL , and thus limit the further reduction in V on [3,6].…”
mentioning
confidence: 99%
“…In addition, in order to improve the short-circuit safe operating area, the saturation current of TIGBT needs to be decreased, which could be achieved by clamping the drain-to-source voltage (V DS ) of the trench nMOS [3,4,6]. However, clamping V DS by depleting the N-layer or by a selfbiased pMOS would limit the value of D NL , and thus limit the further reduction in V on [3,6]. Using the integrated diodes is effective in clamping V DS , but it is costly [4].…”
mentioning
confidence: 99%