A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects

Kumar, Mekala Girish; Agrawal, Yash; Kumar, Vobulapuram Ramesh; Chandel, Rajeevan

doi:10.1016/j.mejo.2021.105294

Microelectronics Journal

2021

DOI: 10.1016/j.mejo.2021.105294

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A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects

Mekala Girish Kumar¹,

Yash Agrawal

Vobulapuram Ramesh Kumar³

et al.

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Cited by 5 publications

(2 citation statements)

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“…11 To avoid these issues and improve the TSV performance, the new material called CNTs which are extracted from graphene can be utilized. 9,12 CNTs are the better material to utilize as filler in the TSVs because of its excellent mechanical, thermal, and electrical properties. [13][14][15][16] The CNTs are categorized as 1) SWCNT and 2) MWCNT.…”

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confidence: 99%

Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic

Basha

Venkatramana²

2022

ECS J. Solid State Sci. Technol.

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The investigation of crosstalk issues for coupled through silicon vias (TSVs) in ternary logic is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi-walled carbon nanotube (MWCNT) as conductive filler, and polymer liners such as polyimide, polypropylene carbonate, and benzocyclobutene (BCB) as insulating materials. For the coupled TSVs, the electrical equivalent circuit model is used to investigate the crosstalk which is driven by the ternary inverter. Based on the Hewlett simulation program with integrated circuit emphasis simulations, the effects of crosstalk such as functional and dynamic crosstalk for proposed TSVs are compared with single-walled CNT (SWCNT) TSVs. Furthermore, the other performance parameters such as power dissipation, power delay product (PDP), and energy delay product are investigated. The crosstalk effects of the proposed model are also examined for various TSV heights. It is noticed that the BCB based coupled MWCNT TSVs provide a significant improvement in crosstalk at reduced TSV height. It is also noticed that the proposed TSVs improved the overall performance up to 30.21% compared to the SWCNT based TSVs. Hence, the MWCNT based TSVs with BCB liner are most suitable for ternary logic integrated circuits over the conventional TSVs.

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Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic

Basha

Venkatramana²

2022

ECS J. Solid State Sci. Technol.

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“…Recent findings have propounded a new stratified model and various structures of mixed CNT bundles. [20][21][22][23][24][25][26] Earlier binary logic which comprises of only two values were used for the design of digital systems. But by using 2-valued logic, design of dense circuits becomes a major problem as interconnects occupy more than 70% of the chip area in binary systems.…”

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confidence: 99%

Temperature Dependent Analysis of Mixed CNT Bundle Interconnecting using Active Shielding Technique

Kumar¹,

E²,

P³

2022

ECS J. Solid State Sci. Technol.

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The cumulative increase of resistivity in copper due to scaling and indispensable requirements of high current densities and unprecedented switching speed are the impelling forces behind the continuous investigation towards the new wiring solution for nanometer circuits and systems. Mixed carbon nanotube bundle (MCB) interconnects are the most optimistic solution that can address the challenges faced by the conventional materials and thereby enhances the lifetime of electrical interconnects. The reliability of the MCB structures are investigated by calculating the propagation delay and power dissipation. The delays and peak crosstalk noise are examined from the transient analysis for all the bundle structures considered in the present study. Further to improve the data rates and performance, CNTFET based ternary logic system is encompassed for MCB interconnects. Active shielding technique is incorporated effectively for minimizing the crosstalk effects. Finally, modelling of the mixed CNT bundle is done under the influence of temperature and the temperature sensitive crosstalk noise effects are investigated for CNTFET based active shielded MCB structures. Encouragingly, it is observed that, the crosstalk effects are lessened to a greater extent for the MCB structure wherein SWCNT’s are placed at the centre and MWCNT’s at the periphery.

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Proposal and analysis of carbon nanotube based differential multibit through glass vias

Kumar

Chandel

Dhiman

2022

Microelectronics Journal

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A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects

Cited by 5 publications

References 48 publications

Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic

Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic

Temperature Dependent Analysis of Mixed CNT Bundle Interconnecting using Active Shielding Technique

Proposal and analysis of carbon nanotube based differential multibit through glass vias

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