A Second-Generation Single-Chip Stereo Imager

Abstract

A second-generation stereo vision chip, fabricated in right image and the left image is found as follows. The pixel values a 0.35gm 4M2P CMOS process and incorporating two 128 x in the block, size (15, N), around the coordinate (x, y) in the right 128 pixel linear current-mode imagers and current-mode image are vertically summed (1). The same is done for all possible disparity computation circuitry, is presented. Parallel target locations (x + d, y) in the left image (2). The SAD matching computation of the sum-of-absolute-difference matching metric for all candidate disparities d is computed (3). The candidate metric allows the chip to produce 114 x 124 pixel depth maps disparity in the search window D producing the smallest SAD value at 30 frames per second, performing 2.2 billion operations per is then deemed the disparity Ax (4). second, while using 10.1mA from a 3.3V supply.y+N-1 rm (x,y)=E R(x, j)(1) I.

Binocular range-sensor LSI with improved distance detection precision by coordinated pixel placement

“…Therefore, these methods have the problem that the detectable distance is limited by the attenuation of the reflected light and interference with natural light. On the other hand, passive systems use a stereocamera [5,6] or binocular-sensor LSI [7,8] to calculate the distance on the basis of stereovision. The stereocamera has synchronization problems and a high cost because it requires two cameras and a high-speed processing device.…”

Three-Dimensional Binocular Range Sensor LSI with Enhanced Correlation Signal

“…3,4) These systems have interference problems, a short detection range, and use high cost devices. On the other hand, passive systems use a stereo camera 5,6) and binocular sensor LSI 7,8) to calculate the distance on the basis of stereo vision. The stereo camera has a high cost, because it requires two cameras and a high-speed processing device.…”

“…The stereo camera has a high cost, because it requires two cameras and a high-speed processing device. Binocular sensor LSIs that calculate the distance using external 7) and internal 8) processes are being developed. The LSIs that use external calculations require extra high-speed processing equipment, so the cost for the device increases.…”