A SERS study of ion adsorption at a copper electrode in-situ

Brown, G.M.; Hope, Gregory Alan

doi:10.1016/0022-0728(95)04400-0

Cited by 59 publications

(33 citation statements)

References 11 publications

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“…Strong convection promotes the adsorption of chloride ions and thus enhances the suppression of PEG but reduces the surface coverage of SPS. The potential-dependent adsorption of chloride ions on the copper surface has been confirmed in many works [28,[35][36][37]. The images obtained from STM have confirmed that SPS cannot compete with chloride ions in adsorption on the copper surface [24].…”

Section: Filling Plating Using Peg-cl-spssupporting

confidence: 74%

Filling mechanism in microvia metallization by copper electroplating

Dow

Yen

Liao

et al. 2008

Electrochimica Acta

117

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Section: Filling Plating Using Peg-cl-spssupporting

confidence: 74%

Filling mechanism in microvia metallization by copper electroplating

Dow

Yen

Liao

et al. 2008

Electrochimica Acta

117

View full text Add to dashboard Cite

“…18 Indeed, a number of works report Cu-Cl stretching modes at ≈290 cm −1 . [54][55][56] However, solid CuCl has no characteristic Raman feature in this region; rather, all strong Raman modes from CuCl are observed at lower wavenumbers. [57][58][59] Furthermore, the electrochemical data shows a continuing high dissolution rate, without even slight drops in current density.…”

Section: Resultsmentioning

confidence: 99%

State of the Surface of Antibacterial Copper in Phosphate Buffered Saline

Toparlı

Hieke

Altin

et al. 2017

J. Electrochem. Soc.

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The state was investigated of the copper surface in phosphate buffered saline (PBS; 140 mM Cl − , 10 mM phosphate; pH 7) by a combination of cyclic voltammetry (CV) and chronoamperometry (CA) with in situ spectroscopic ellipsometry and Raman spectroscopy. After polarization, samples were analyzed ex situ. In agreement with expectations on the basis of the Pourbaix diagram, Cu 2 O and Cu 4 O 3 were observed when polarizing the system above ≈−0.05 V vs. Ag|AgCl|3M KCl. The formation of Cu 2 O did not lead to a passivation of the system. Rather, the system dissolved under formation of soluble square planar CuCl 2− 4 , identified by its strong Raman peak ≈300 cm −1 . During dissolution, spectroscopic ellipsometry showed a film with a stable steady state thickness. Energy electron loss spectroscopy (EELS) analysis of a cross section of the oxide after removal from the electrolyte showed that the oxide was Cu 2 O. It is suggested that Cl − replaces oxygen vacancies in the oxide layer. As soon as oxidation to Cu II becomes dominant, the dissolution proceeds to soluble Cu II species. The outer surface of copper under these conditions is hence a Cu 2 O-like surface, with Cu II complexes present in solution.

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“…7 to facilitate comparison and discussion on the interaction of ATU with a copper electrode in a sulfuric acid solution. Assignment of the different vibrational bands is performed by combining the information from the spectra and from the literature [17][18][19][20][21][22]. A summary of SERS vibrational frequencies and their detailed assignments is given in Table 1.…”

Section: In Situ Sers Studiesmentioning

confidence: 99%

“…TU is also used as an acid inhibitor in industrial operations, such as pickling, descaling, cleaning, and acidisation of oil wells, to protect metals and alloys [9][10][11]. Consequently, the effect of TU on both the electrodeposition and electrodissolution of copper from acidic sulfate electrolytes has been studied in detail with a variety of techniques [12][13][14][15][16][17][18][19][20][21][22]. In the presence of TU, the electrodeposition and electrodissolution of copper become relatively complex due to the concurrence of electrochemical reactions at the copper/TU-containing solution interface [23,24], the chemical reactions between TU and copper ions in the solution [25], and the strong chemisorption of TU and its reaction products [26].…”

Section: Introductionmentioning

confidence: 99%

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SERS and EQCM studies on the effect of allyl thiourea on copper dissolution and deposition in aqueous sulfuric acid

et al. 2008

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We investigated the effect of allyl thiourea (ATU) on both the electrodeposition and electrodissolution of copper in aqueous sulfuric acid by combining cyclic voltammetry (CV) with electrochemical quartz crystal microbalance (EQCM) studies and surface enhanced Raman spectroscopy (SERS). The results demonstrated that the two-electron transfer reaction is the predominant process for the copper dissolution-deposition process in 1.0 M H2SO4 solution not containing ATU in the potential range -0.65 to 0.05 V versus SCE. In comparison, the copper dissolution-deposition process in 1.0 M H2SO4 solution containing ATU corresponds to a one-electron transfer reaction. The spectral features observed from the SERS studies showed at molecular level that ATU can be adsorbed tilted to the copper electrode surface and that coordination occurs via the sulfur atom. The secondary amino group is nearer to the surface than the primary amino group. SO42- and HSO4- can be coadsorbed on the protonated -NH (CH2CHCH2) groups.Natural Science Foundation of China [20433040]; Natural Science Foundation of Fujian Province [E0310026

show abstract

A SERS study of ion adsorption at a copper electrode in-situ

Cited by 59 publications

References 11 publications

Filling mechanism in microvia metallization by copper electroplating

Filling mechanism in microvia metallization by copper electroplating

State of the Surface of Antibacterial Copper in Phosphate Buffered Saline

SERS and EQCM studies on the effect of allyl thiourea on copper dissolution and deposition in aqueous sulfuric acid

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