Adhesion strength of die attach film for thin electronic package at elevated temperature

Mose, Bruno R.; Son, In-Seo; Shin, Dong Ok

doi:10.1016/j.microrel.2018.07.143

Cited by 5 publications

(3 citation statements)

References 15 publications

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“…The die bonding platform is made of Ti-6AI-4V(TC4) with excellent thermostability and maintains contact with the heating plate under compression of the upper holder block and lower holder block. Therefore, the trend of the die bonding platform temperature rise is consistent with the trend of the heating plate temperature rise [8]. The microperforated channels in the middle of the die bonding platform are filled with negative pressure air, so the thermopile base is tightly sucked on the surface of the die bonding platform.…”

Section: Novel Die Bonding Stagesupporting

confidence: 71%

Temperature Field Analysis of Novel Die Bonding Stage for MEMS Thermopile

Chen

2023

IEEJ Transactions Elec Engng

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Packaging and die bonding of conventional micro‐electro‐mechanical‐systems (MEMS) and semiconductor devices include separate dispensing, mounting and heating curing. A novel die bonder's work stage and temperature control method are proposed so that dispensing, mounting and heating curing can be completed at the same station. This paper introduces the working principle of the thermopile sensor and the requirements for temperature change during die bonding, analyses the main structure and working process of the novel die bonding stage, and uses commercial finite element analysis software to evaluate the temperature field of the novel die bonding stage and devices during the process of heating, holding and cooling to provide process guidance for accurate temperature control of die bonding. Dispensing, mounting and heating curing are integrated in the same station, avoiding the position error of devices when transferring, reducing the number of equipment and floor area, and effectively saving production costs. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

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Section: Novel Die Bonding Stagesupporting

confidence: 71%

Temperature Field Analysis of Novel Die Bonding Stage for MEMS Thermopile

Chen

2023

IEEJ Transactions Elec Engng

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“…Thus, die attach films (DAFs) have been introduced and became more popular recently due to their lack of not only voids, but also their absence of paste bleeding and slanting. 11,[13][14][15][16] The requirements of DAFs in modern high density 3D electronic packages include low heat resistance, high adhesion strength, high glass transition temperature (T g ), and low coefficient of thermal expansion (CTE). 11,[17][18][19][20][21] Epoxy resins as the matrix of polymer composites have already been applied in DAF vendors such as Henkel and AI Technology for several years because epoxy resins have many hydroxyl groups after curing, which provide strong adhesion strength between the die and substrate.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, die attach films (DAFs) have been introduced and became more popular recently due to their lack of not only voids, but also their absence of paste bleeding and slanting. 11,13–16…”

Section: Introductionmentioning

confidence: 99%