Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation

Abstract

This paper presents a comprehensive method for obtaining urgently required critical interface delamination data of material pairings used in electronic packaging. The objective is to thereby enable rapid, inexpensive and accurate lifetime prediction for that failure mode. A new testing method is presented which allows maximum mode-angle range and enhanced throughput testing under multiple loading conditions, the coverage of which is usually a rather lengthy and resource-demanding procedure. The approach is specimen-centred in the sense that the accent is put on test-specimens which are easily manufacturable industrially, rather than having to adapt them to a special testing machine. The concept is also scalable, i.e. it has potential to work also for smaller samples cut from real devices. We show the first version of a newly developed test-stand and discuss the obtained results for copper-molding compound interfaces in the light of the current state of the art used for delamination testing in electronic packaging

Reliability of a dual-curable adhesive bond

“…To verify this hypothesis, the fracture toughness is planned to be tested statically and cyclically with state of the art methods. The Advanced Mixed-Mode Bending (AMB), developed by B. Wunderle et al [13] can determine the fracture toughness from pure shear to pure tension, depending on the position of the pressure points. A bending specimen is chosen for cyclic testing.…”

Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations

“…These methods are all based on mechanical or thermo-mechanical theories and have been successfully applied to a variety of interfaces [16][17][18][19][20][21][22][23][24][25][26][27][28][29]. Of the mentioned techniques, 4-point bending (4PB) was found to be suitable to determine the steady state energy release rate (adhesion energy) between different kinds of metal-dielectric interfaces [30][31][32][33][34]. The 4PB test is highly valuable for studying multilayer systems because the interfaces of interest are sandwiched between two elastic substrates.…”

An accelerated method for characterization of bi-material interfaces in microelectronic packages under cyclic loading conditions

“…The influence of moisture on the delamination behavior were also examined by [6], [7]. Advanced Mixed-mode bending (AMB) test recently were developed which can provide an enhanced mode mixity range with only couple of samples [8] under monotonic loading. Fatigue crack propagation along polymer-metal interfaces in microelectronic packages was investigated using hand-made Double Cantilever Beam (DCB) sam ples under force-controlled loading condition by [9].…”