2014
DOI: 10.11648/j.optics.20140302.12
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AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface

Abstract: Abstract:The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were … Show more

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Cited by 3 publications
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“…Because chloride ions have a higher polarizability than other anions, they can even enhance the deposition of most metals. The polarizability of chloride ions (8.9 cm 3 /mol) is greater than that of sulphate ions (3.9 cm 3 /mol); thus, whereas the exchange current density for Zn deposition in a sulphate solution is ~ 3.10 − 5 A/cm 2 , it is an order of magnitude higher in chloride solutions [37] [38] [39]. The effect of chloride ions on the current e ciency and morphology of Zn deposit during electrolysis is still subject to several uncertainties.…”
Section: Introductionmentioning
confidence: 99%
“…Because chloride ions have a higher polarizability than other anions, they can even enhance the deposition of most metals. The polarizability of chloride ions (8.9 cm 3 /mol) is greater than that of sulphate ions (3.9 cm 3 /mol); thus, whereas the exchange current density for Zn deposition in a sulphate solution is ~ 3.10 − 5 A/cm 2 , it is an order of magnitude higher in chloride solutions [37] [38] [39]. The effect of chloride ions on the current e ciency and morphology of Zn deposit during electrolysis is still subject to several uncertainties.…”
Section: Introductionmentioning
confidence: 99%