All Hot Wire CVD Organic/Inorganic Hybrid Barrier Layers for Thin Film Encapsulation

Abstract

A water vapor barrier layer is presented that is deposited entirely at temperatures below ∼100oC. Our method, using hot wire chemical vapor deposition (HWCVD), is effective in reducing the issue of pinholes in single layers of silicon nitride (SiNx) made at such low substrate temperatures. We succeeded in depositing an all hot-wire simple three-layer structure consisting of two low-temperature SiNx layers with a polymer layer in between, exhibiting a water vapor transmission rate (WVTR) as low as 5*10-6 g/m2/day, determined at a temperature of 60°C and a relative humidity of 90%. This WVTR is low enough for organic and polymer devices. In a second experiment the robustness of the barrier layer is shown with respect to environmental dust.

Optical Transmission in a Silicon Nitride/Polymer Multilayer Permeation Barrier made by Hot-Wire CVD: Model and Experiment

“…Multilayers, which are known to have an extremely good barrier function [5], were deposited on glass. The transmission of three different multilayer structures was determined experimentally; a structure containing four 50 nm SiN x layers, a structure with three 67 nm SiN x layers, and a structure with two 100 nm SiN x layers, where in each structure all SiN x layers are separated by 200 nm PGMA layers.…”

Large‐Scale Manufacturing of Polymer Planarization Layers

“…Exposure to temperature and UV or particle radiation during inorganic deposition can lead to the organic layers’ damage and instability. Morphological changes of poly glycidyl methacrylate (PGMA) films induced by temperature in i‐CVD deposition of a SiN x /organic multilayer barrier has been reported 18 . The same group demonstrated that damage could be avoided by using 1,3,5‐trivinyl‐1,3,5‐trimethyl cyclotrisiloxane (V3D3).…”