All-porous heterostructure of reduced graphene oxide–polypyrrole–nanoporous gold for a planar flexible supercapacitor showing outstanding volumetric capacitance and energy density

Purkait, Taniya; Singh, Guneet; Kamboj, Navpreet; Das, Manisha; Dey, Rajeeb

doi:10.1039/c8ta07627h

Cited by 55 publications

(37 citation statements)

References 63 publications

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Section: Discussionsupporting

confidence: 81%

“…The obtained results demonstrate that the capacitance properties of GO-modified PPy coatings could be easily improved without it being necessary to employ other nanoparticles, complex architectures, or harmful reagents [6,16,33,[41][42][43]. Despite the fact that the varying test parameters allowed only a qualitative comparison with the literature, it was observed that the performance of the obtained thin hybrid PPy/rGO coatings was similar to other reports [41]. The benefits of the present work consist of the improvement of the capacitance properties by simply adjusting the electrochemical parameters while using less added GO, thanks to the use of an anionic surfactant to better disperse the GO sheets and enhance their reactivity.…”

Section: Discussionmentioning

confidence: 78%

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Effect of Deposition Parameters on Electrochemical Properties of Polypyrrole-Graphene Oxide Films

2020

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Graphene oxide (GO)-modified polypyrrole (PPy) coatings were obtained by electrochemical methods in the presence of the anionic surfactant, sodium dodecyl sulfate (SDS). The structure, morphology, and electrochemical properties of the coatings were assessed by Fourier transform infrared (FTIR) spectroscopy, Raman spectroscopy, scanning electron microscopy (SEM) and cyclic voltammetry at varying scan rates, respectively. The properties of the obtained coatings were analyzed with the GO and PPy loadings and electrodeposition mode. The hybrid coatings obtained galvanostatically showed a coarser appearance than those deposited by cyclic voltammetry CV mode and improved performance, respectively, which was further enhanced by GO and PPy loading. The capacitance enhancement can be attributed to the SDS surfactant that well dispersed the GO sheets, thus allowing the use of lower GO content for improved contribution, while the choice of suitable electrodeposition parameters is highly important for improving the applicability of GO-modified PPy coatings in energy storage applications.

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Section: Discussionsupporting

confidence: 81%

Section: Discussionmentioning

confidence: 78%

Effect of Deposition Parameters on Electrochemical Properties of Polypyrrole-Graphene Oxide Films

2020

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“…Among the various electrodes, flexible and porous electrodes not only provide an interconnected network as electron and ion pathways for efficient charge and mass exchange during faradic redox reactions, but also allow more electroactive sites to be exposed to the electrolyte . Although many three‐dimensional (3D) electrode architectures have been developed, such as carbon nanotube sponges, graphene aerogels, metal foams, and polymer hydrogels, there are still many issues to be addressed: 1) carbon nanotube sponges and graphene aerogels are difficult to be produced in large scale because of their relatively high cost and/or complex preparation processes; 2) carbon foams are usually less conductive as compared to metals; 3) rigid electrodes with metals as current collectors cause their devices less flexible; and 4) most 3D electrodes possess structures with single macropores, which could form ion‐buffering reservoirs and accelerate ion transport, but contribute little to the large surface area for depositing electroactive substances, thus resulting in relatively low capacitances . Therefore, it is imperative to develop novel 3D electrodes with hierarchical pores, high conductivity, good flexibility, and easy fabrication.…”

Section: Introductionmentioning

confidence: 99%

In Situ Growth of Hierarchical Ni‐Mn‐O Solid Solution on a Flexible and Porous Ni Electrode for High‐Performance All‐Solid‐State Asymmetric Supercapacitors

Yang³

et al. 2019

Chemistry A European J

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To endow all‐solid‐state asymmetric supercapacitors with high energy density, cycling stability, and flexibility, we design a binder‐free supercapacitor electrode by in situ growth of well‐distributed broccoli‐like Ni0.75Mn0.25O/C solid solution arrays on a flexible and three‐dimensional Ni current collector (3D‐Ni). The electrode consists of a bottom layer of compressed but still porous Ni foam with excellent flexibility and high electrical conductivity, an intermediate layer of interconnected Ni nanoparticles providing a large specific surface area for loading of active substances, and a top layer of vertically aligned mesoporous nanosheets of a Ni0.75Mn0.25O/C solid solution. The resultant 3D‐Ni/Ni0.75Mn0.25O/C cathode exhibits a specific capacitance of 1657.6 mF cm−2 at 1 mA cm−2 and shows no degradation of the capacitance after 10 000 cycles at 3 mA cm−2. The assembled 3D‐Ni/Ni0.75Mn0.25O/C//activated carbon asymmetric supercapacitor has a high specific capacitance of 797.7 mF cm−2 at 2 mA cm−2 and an excellent cycling stability with 85.3 % of capacitance retention after 10 000 cycles at a current density of 3 mA cm−2. The energy density and power density of the asymmetric supercapacitor are up to 6.6 mW h cm−3 and 40.8 mW cm−3, respectively, indicating a fairly promising future of the flexible 3D‐Ni/Ni0.75Mn0.25O/C electrode for efficient energy storage applications.

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“…For instance, a hybrid graphite flake/PPy electrode MSC showed a capacitance of 6 mFcm −2 . Hybrid rGO/PPy was deposited on NPG to form a 3D heterstructure with high conductivity, and the fabricated flexible MSC showed an area capacitance of 29.21 mFcm −2 with an unprecedented energy density of 98.48 mWhcm −3 …”

Section: Materials For Msc Electrodesmentioning

confidence: 99%

On‐Chip Microsupercapacitors: From Material to Fabrication

Wang

Zhang

2019

Energy Tech

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Microsupercapacitors (MSCs) are integrated into microdevices or chip‐based systems to store energy and power the chip efficiently, as they present excellent performance capabilities including high power density, fast charge/discharge rate, and long cycle time. Providing sufficient surface area and high electric conductivity are effective ways to enhance ion diffusion and charge transportation in electrodes, which in turn leads to high performance behavior. Herein, the novel progress of on‐chip MSCs in the past few years ranging from active materials synthesis to high‐resolution fabrication techniques is summarized, and the strategies to enhance the performance of MSCs are focused upon. From conventional materials to nanocomposite hybrid structures, the main active materials for MSC electrodes and the related fabrication techniques are reviewed in detail according to their different electrochemical performance. It is concluded that hierarchical porous‐structured materials and high‐resolution fabrication processes are of great importance in constructing high‐performance devices, which also demonstrates the future developing direction of on‐chip energy devices. The new developments of fabrication technologies such as microfabrication, laser direct writing, and inkjet printing are also discussed to show their advantages in forming high‐performance electrodes.

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All-porous heterostructure of reduced graphene oxide–polypyrrole–nanoporous gold for a planar flexible supercapacitor showing outstanding volumetric capacitance and energy density

Abstract: We propose a new prototype of flexible planar supercapacitor with highly conductive all-porous morphology of all the electroactive layers that shows outstanding volumetric stack capacitance (245.34 F cm−3) and energy density (98.48 mW h cm−3).

Cited by 55 publications

References 63 publications

Effect of Deposition Parameters on Electrochemical Properties of Polypyrrole-Graphene Oxide Films

Effect of Deposition Parameters on Electrochemical Properties of Polypyrrole-Graphene Oxide Films

In Situ Growth of Hierarchical Ni‐Mn‐O Solid Solution on a Flexible and Porous Ni Electrode for High‐Performance All‐Solid‐State Asymmetric Supercapacitors

On‐Chip Microsupercapacitors: From Material to Fabrication

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