An experimental investigation of temperature in high speed deep grinding of partially stabilized zirconia

Xie, Guizhi; Huang, Han

doi:10.1016/j.ijmachtools.2008.06.002

Cited by 52 publications

(37 citation statements)

References 22 publications

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“…Besides, thin film thermocouples or foil thermocouples were also utilised in Refs. [2,[37][38][39][40][41], which have the advantages including the extremely small size of the measure junction to capture temperature signals within a very small area [42].…”

Section: Introductionmentioning

confidence: 99%

On a stochastically grain-discretised model for 2D/3D temperature mapping prediction in grinding

Axinte

2017

International Journal of Machine Tools and Manufacture

100

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Excessive grinding heat might probably lead to unwanted heat damages of workpiece materials, most previous studies on grinding heat/temperature, however, assumed the wheel-workpiece contact zone as a moving band heat source, which might be not appropriate enough to capture the realistic situation in grinding. To address this, grinding temperature domain has been theoretically modeled in this paper by using a stochastically grain-discretised temperature model (SGDTM) with the consideration of grain-workpiece micro interactions (i.e. rubbing, ploughing and cutting), and the full 2D/3D temperature maps with highly-localised thermal information, even at the grain scale (i.e. with the thermal impacts induced by each individual grain), has been presented for the first time. To validate theoretical maps, a new methodological approach to capture 2D/3D temperature maps based on an array of sacrificial thermocouples have also been proposed. Experimental validation has indicated that the grinding temperature calculated by SGDTM showed a reasonable agreement with the experimental one in terms of both 1D temperature signals (i.e. the signals that are captured at a specific location within the grinding zone) and the 2D/3D temperature maps of the grinding zone, proving the feasibility and the accuracy of SGDTM. This study has also proved that, as expected, the heat fluxes are neither uniformly-distributed along the wheel width direction nor continuous along the workpiece feed direction. The proposed SGDTM and the temperature measurement technique are not only anticipated to be powerful to provide the basis for the prevention of grinding thermal damage (e.g. grinding burns, grinding annealing and rehardening), but also expected to be meaningful to enhance the existing understanding of grinding heat/temperature than using the common approach depending on the single thermocouple technique.

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Section: Introductionmentioning

confidence: 99%

On a stochastically grain-discretised model for 2D/3D temperature mapping prediction in grinding

Axinte

2017

International Journal of Machine Tools and Manufacture

100

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“…Grinding with ultrafine abrasive tools is one of the most widely used processes for precision machining of many materials such as ceramics, glass, natural stone materials, and novel materials used in the semiconductor industry [1][2][3][4]. In the production of ultrafine abrasive tools for grinding, resin and copper are two common bonds, in which case ultrafine abrasives are supposed to distribute uniformly in either resin or copper.…”

Section: Introductionmentioning

confidence: 99%

Vertical Spindle Grinding of Si and Granite with a New Abrasive Disk

Liu

Kuang

et al. 2013

Advances in Mechanical Engineering

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An investigation was reported of a new attempt in the fabrication of an ultrafine abrasive tool for vertical spindle grinding. The principle of sol-gel was applied to granulate ultra-fine abrasives in order to reduce their aggregation. The granulated abrasives were then added to resin bonds, thereby forming ultra-fine abrasive grinding disks. Before grinding, the disks were dressed to expected flatness using a brazed diamond pad. The dressed grinding disks were then used to grind silicon wafers and natural granite. Both dressing and grinding were conducted on a high precision vertical spindle grinding machine. After grinding, the morphologies of the workpiece materials were examined. With regard to the different concerns for silicon wafers and granite, surface roughness was measured for the silicon wafers and gloss readings were measured for the granite surfaces. It was found that the brazed diamond abrasives could dress the grinding disks with high efficiency and satisfactory flatness. The new ultra-fine abrasive disks were found to be able to process silicon wafers and granite slabs to acceptable results.

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“…It was showed that the increasing in cutting speed could reduce edge chipping width. On the other hand, an experimental investigation of temperature in high speed deep grinding of partially stabilized zirconia has been conducted [7]. It has been reported that the high lubrication pressure is an important factor in reducing the cutting force and that would subsequently reduce edge chipping while machining brittle materials.…”

Section: Introductionmentioning

confidence: 99%

“…It has been reported that the high lubrication pressure is an important factor in reducing the cutting force and that would subsequently reduce edge chipping while machining brittle materials. The high lubrication pressure can also be used as a coolant in machining of difficult-to-cut materials to reduce the cutting temperature for lower flank wear, longer tool life, and a better surface finish [7].…”

Section: Introductionmentioning

confidence: 99%

“…Good correlation between the feed rate change and edge chipping of ceramic materials is observed [6]. The effect of feed rate and depth of cut on increasing the grinding temperature and cutting force of stabilized zirconia in the high speed grinding process have been investigated [7]. Research on alumina, alumina-titania, and zirconia has been conducted to demonstrate the effect of material removal rate by increasing the depth of cut in high speed grinding [8].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Experimental Study on Minimizing Edge Chipping in Glass Milling Operation Using an Internal CBN Grinding Tool

Karim

Sarhan

Shukor

2011

Materials and Manufacturing Processes

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An experimental investigation of temperature in high speed deep grinding of partially stabilized zirconia

Cited by 52 publications

References 22 publications

On a stochastically grain-discretised model for 2D/3D temperature mapping prediction in grinding

On a stochastically grain-discretised model for 2D/3D temperature mapping prediction in grinding

Vertical Spindle Grinding of Si and Granite with a New Abrasive Disk

Experimental Study on Minimizing Edge Chipping in Glass Milling Operation Using an Internal CBN Grinding Tool

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