An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder

Chan, Chien-Feng; Lahiri, S. K.; Yuan, Peiyan; How, J.

doi:10.1109/eptc.2000.906352

Cited by 14 publications

(2 citation statements)

References 2 publications

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“…The average energy, laser heating time and laser spot diameter were 16mJ, 4ms, 100µm respectively in the pre-bump process, while 35mJ, 5ms, 40µm in the reflow process. The melting temperature of the solder is 216~220℃ [10]. The vertical pad has a Ta/NiFe/Au surface finish over Cu, with about 0.01um, 0.1um, 0.8um in thickness respectively, and the horizontal pad had a Ni/Au surface finish over Cu trace, with about 1.0 um and 0.5um in thickness respectively, as shown in Figure 1.…”

Section: Methodsmentioning

confidence: 99%

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

Tian

Chen

Wang

2005 6th International Conference on Electronic Packaging Technology

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The interfacial microstructure evolution between Sn-3.5Ag-0.75Cu solder ball and Au/Ni/Cu pad was investigated under as-bonded and thermal aging conditions. Moreover, the shear and mechanical shock tests were carried out to study the failure mechanisms. Results showed that only one intemetallic compound, fine needle-like AuSn 4 was found at the solder/pad interface under as-bonded condition. After aging, Ag 3 Sn appeared in the solder bulk as a particle-like or elongated structure. Meanwhile, the intermetallic compounds layer became flat and a quaternary intermetallic compound Cu-Sn-Ni-Au appeared between AuSn 4 layer and Ni(NiFe) layer. In addition, parts of AuSn 4 spalled into the solder bulk with long hour aging. In the shear test, the solder joint exhibited a ductile failure. While in the mechanical shock test, the cracks initiated at the right end of the horizontal pad and propagate through the interfaces between IMCs. Furthermore, the factors dominating the failure mode were investigated which consists of external force and stress distribution, interfacial reaction and strain rate.

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Section: Methodsmentioning

confidence: 99%

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

Tian

Chen

Wang

2005 6th International Conference on Electronic Packaging Technology

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“…The eutectic composition for the Sn-Ag binary system occurs at [62][63][64], however intermetallics growth is a problem for the use of the alloy systems. Salam [2] reported the thickness of the intermetallic layer for Sn-4.0Ag-0.5Cu alloy after ageing was higher than that of the Sn-37Pb alloy, as seen Because of its brittle nature and microstructural mismatch between solder and copper, too thick a Cu-Sn IMC layer at the solder /Cu interface causes the interface in the solder joint to be more sensitive to stress [65].…”

Section: Sn-ag Alloymentioning

confidence: 99%

Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

Chen¹

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Chapter 4 IMC growth and kinetics of as-soldered Sn-3.5Ag-0.7Cu-xSb solder joints 4.1 Introduction 4.2 Thermal properties of Sb-containing solder alloys 4.3 Phases formation during liquid-solid reaction in Sb-containing solder joints 4.4 Microstructural Evolution 4.5 Growth kinetics of the IMC formation 4.6 Sb additive effect-Heterogeneous nucleation 4.7 Summary Chapter 5 IMC growth and kinetics in Sn-3.5Ag-0.7Cu-xSb solder joints during ageing IV ATTENTION: The Singapore Copyright Act applies to the use of this document. Nanyang Technological University Library Table of contents Chapter 6 Effect of Sb composition and Testing Parameters on Tensile Strength of Sn-3.5Ag-0.7Cu Solder Alloys and Solder Joints 6.1 Introduction 6.2 Tension properties of Sb-containing solder alloys 6.2.1 Microstructure analysis of tensile testing specimens 6.2.2 Effect of strain rate on the tensile strength of Sb-containing solder alloys... 6.2.3 Effect of temperature on tensile strength 6.2.4 Effect of Sb additives on mechanical strength-solid solution hardening... 6.3 Tension properties of Sb-containing solder joints 6.3.1 Effect of ageing time and Sb composition on tensile strength of Sn-3.5Ag-0.7Cu solder joints 6.3.2 Failure analysis of tensile testing solder joints 6.3.3 Effect of Sb addition on tension strength-particle hardening 6.4 Summary Chapter 7 Rapid Temperature Cycling testing methodology for reliability assessment of solder interconnection 7.1 Introduction 7.2 Thermal distribution of RTC 7.3 Failure analysis of ATC and RTC testing 7.4 Statistical Analysis ofATC and RTC testing 7.5 ATC and RTC numerical analysis 7.5.1 FE simulation 7.5.2 Simulation results and analysis 7.6 Summary Chapter 8 Conclusions and Recommendations 8.1 Conclusions 8.

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Effects of bulk Cu₆Sn₅ intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

Zhang

Xue

Gao

et al. 2011

Soldering &Amp; Surface Mount Technology

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Purpose -The purpose of this paper is to explore the formation and growth mechanism of bulk Cu 6 Sn 5 intermetallic compounds, selecting Sn-Ag-Cu-Ce solders as specimens. Design/methodology/approach -In order to further enhance the properties of SnAgCu solder, trace amount of rare earth Ce was selected as alloying addition into the alloy; in previous investigations, the enhancements include better wettability, physical properties, creep strength and tensile strength. In this paper, the microstructure of Sn-Ag-Cu-Ce soldered joints and its interfacial intermetallic compounds were investigated. Moreover, different morphologies of Cu 6 Sn 5 IMCs were enumerated and described, and Ostwald ripening theory was employed to interpret the formation mechanism of bulk Cu 6 Sn 5 IMCs. Findings -In addition, based on finite element simulation, it is found that the von Mises stress concentrate around the bulk Cu 6 Sn 5 IMCs inside the Sn-Ag-Cu-Ce soldered joints after three thermal cycling loading (2 55-1258C). From the stress distribution, the failure site was predicted to fracture near the bulk Cu 6 Sn 5 IMCs interface. This coincides with the experimental findings significantly. Originality/value -The results presented in this paper may provide a theory guide for developing novel lead-free solders as well as reliability investigation of lead-free soldered joints.

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An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder

Cited by 14 publications

References 2 publications

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

Effects of bulk Cu₆Sn₅ intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

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An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder

Cited by 14 publications

References 2 publications

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

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Effects of bulk Cu₆Sn₅ intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints