An Overview of Electrical Characterization Techniques and Theory for IC Packages and Interconnects

McGibney, E.; Barrett, J.

doi:10.1109/tadvp.2005.849550

Cited by 21 publications

(2 citation statements)

References 54 publications

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“…There are two popular approaches to characterize packages: 1) using frequency-domain measurements and 2) with timedomain measurements [3]. The first approach associates an nport network (a 2-port network in the case of single-ended packages) to the device under test (DUT), and the measurements correspond to a set of parameters that fully describe this network.…”

Section: Package Characterization Approachesmentioning

confidence: 99%

Characterization and modeling of electronic packages using S-parameters

Hernandez-Sosa

Romo²,

Torres‐Torres

2008

2008 7th International Caribbean Conference on Devices, Circuits and Systems

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In this paper, we demonstrate the feasibility to characterize and model singled-ended electronic packages using experimental S-parameters up to 30 GHz. TRL calibration and transmission line theory techniques were applied to obtain the two-port network parameters of the packages from measurements performed to package-to-transmission line test structures. With this information, an assessment of the performance of the package was carried out, as well as the development of equivalent circuit models to represent this structure up to 30 GHz. The methodology is explained step-by-step including the description of the required prototypes. Excellent agreement of the resulting models with experimental data validates the proposed methodology.

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Section: Package Characterization Approachesmentioning

confidence: 99%

Characterization and modeling of electronic packages using S-parameters

Hernandez-Sosa

Romo²,

Torres‐Torres

2008

2008 7th International Caribbean Conference on Devices, Circuits and Systems

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“…As shown in Figure 1, many packages with different structures are competing and evolving according to their structural characteristics and applications. But there are still no robust solutions to accommodate high thermal and electrical performance like leadframe package (McGibney and Barrett, 2006;Li et al, 2018;Wu et al, 2014) while gives design flexibility. In response to this need, routable molded leadframe (rtMLF), combining the two advantages of the high reliability of a leadframe and the design flexibility of a laminate package, has been developed (Kim et al, 2022a(Kim et al, , 2022b.…”

Section: Introductionmentioning

confidence: 99%

The advanced leadless leadframe package and its characteristics

Kim¹,

Jeon²,

Gijeong³

et al. 2023

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Purpose The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the continuous market requirement. Because of demand and trends, new package structures that can accommodate many pins (I/Os) while maintaining the excellent thermal and electrical properties of the leadframe package was studied. Different from conventional leadframe and laminate packages, it must have the large-exposed pad for thermal dissipation and design flexibility to deploy signal, ground and power selectively. Design/methodology/approach In this study, the routable molded leadframe (rtMLF®) package applying the pre-resin MLF substrate was introduced. The structural advantages, in terms of design flexibility, were checked by adopting the specific electrical feature. Also, the excellence of thermal and electrical performance was confirmed by simulation. The sample was manufactured, and its package robustness was validated by reliability test. Findings rtMLF package that enables one layer substrate but routable pattern on top layer differently from existing leadframe package was developed and studied if it overcome the limitations of leadframe and laminate products. Asymmetric land layout was designed and special features to keep electrical interference was applied to prove design flexibility. The thermal and electrical simulation has been executed to check the advantages. And key differentiations were identified. Finally, actual sample was manufactured, and structural robustness was validated by package level and board level reliability. Originality/value The differentiation of new semiconductor package was introduced and its excellence was verified by electrical and thermal simulation as well as reliability test. It is expected to be adopted for alternative solutions not covered by the existing products.

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Integrated Circuit Characterisation Using Low-Cost Coaxial Probe Measurement

Ding

Ngu

2021

Advances in Electrical and Electronic Engineering and Computer Science

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An Overview of Electrical Characterization Techniques and Theory for IC Packages and Interconnects

Cited by 21 publications

References 54 publications

Characterization and modeling of electronic packages using S-parameters

Characterization and modeling of electronic packages using S-parameters

The advanced leadless leadframe package and its characteristics

Integrated Circuit Characterisation Using Low-Cost Coaxial Probe Measurement

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